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Important Information

The 16th PRINTED WIRING BOARD EXPO and the 16th IC PACKAGING TECHNOLOGY EXPO

Dates:
  January 14(Wed.) - 16(Fri.), 2015
  10:00 - 18:00 (Last day until 17:00)
Location:
  Tokyo Big Sight, Japan
  East Hall 4 Booth No. EAST 37-38
Description:
  PWB Materials
  Packaging Materials
  Process Material
  Printed Wiring Boards
  New Materials
Official Web Site:
  http://www.pwb.jp/en/Home/
  http://www.icp-expo.jp/en/Home/
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