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Important Information

SEMICON China 2015

Dates:
  March 17th(Tue) - 19th(Thu) 9:00 - 17:00
   (19th 9:00 - 16:00)
Location:
  Shanghai New International Expo Center (SNIEC),
  Shanghai, China
  Booth No. 4681-10, Hall W4
Description:
  Epoxy Molding Compounds
  Die Attach Film
  Die Bonding Paste
  Under-fill Materials
  Release / MAP Molding Support Film
  Coating Polyimides
  Other Materials
Official Web Site:
  http://www.semiconchina.org/
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