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CAR-ELE JAPAN-10th Int'l Automotive Electronics Technology Expo

Dates:
 Jan. 17th(Wed) - 19th (Fri), 2018
 10:00 - 18:00* Jan. 19th 10:00 - 17:00
Location:
 Tokyo Big Sight, Japan
 East Hall 5 Booth No. E44-14
Products:
 - High Thermal Resistant Epoxy Molding Compound
 - High Thermal Resistant Encapsulant for Case Module
 - Sintering Cu bonding paste
 - Low Elastic Transient Liquid Phase Sintering Paste
 - Resin Insulated Thick Copper Substrate for High Current Power Device
 - High Heat Resistant Insulating Coating Materials
 - Thermal Conductive Sheet Materials Containing Vertically
Official Web Site:
http://www.automotiveworld.jp/en/About/CAR-ELE_JAPAN/

19th IC & Sensor Packaging Technology Expo in NEPCON JAPAN 2018

Dates:
 Jan. 17 (Wed) Jan. 19 (Fri)
 10:00am-6:00pm on Jan.17 & 18,
 10:00am-5:00pm on Jan.19
Location:
 Tokyo Big Sight
 East Hall 3, Booth No: E28-001
Description:
 - Photosensitive Insulation Film for Encapsulation and Embedding PX-1000
 - Low Transmission Loss Build-up Film AS-500HS
 - Low Transmission Loss Build-up Film AS-400HS
 - Low Transmission Loss / Low CTE Materials MCL-HS100
 - Encapsulation Material for High Frequency Devices CEL-X-DF series
 - Stretchable Substrate Material
Official Web Site:
http://www.nepconjapan.jp/en/About/ICP/
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