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Important Information

18th IC PACKAGING TECHNOLOGY EXPO

Dates:
 January 18 (Wed) - 20 (Fri), 2017
 18-19th, 10:00-18:00 / 20th, 10:00-17:00
Location:
 Tokyo Big Sight, Tokyo, Japan
 Booth No. W4-42, West Hall 1
Description:
 - Semiconductor Package Related Materials
 - New Materials
 - Materials for Wearable / Display / IoT
 - Printed Wiring Boards
Official Web Site:
http://www.nepconjapan.jp/en/About/ICP/
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