Page Link

Events & Exhibition

Schedule

 

Past Events & Exhibition

JPCA Show 2017 (47th International Electronic Circuits Exhibition)

Dates June 7th (Wed) - 9th (Fri) 2017
Location Tokyo Big Sight, Japan
Description Open Laboratory Solution
  • Introduction of Hitachi Chemical Open Laboratory
Base Materials
  • Base Materials for Packages and Modules
  • Copper Clad Stretchable/Flexible Film
Photosensitive Dry Film
  • Photosensitive Materials for Fine Patterning
  • Photosensitive Insulation Materials
Equipment for PWB and PWB related Materials
  • Laminator/Others
Official Web Site

2nd CERAMICS JAPAN - Highly-functional Ceramics Expo

Dates April 5(Wed.) - 7(Fri.), 2017
Location Tokyo Big Sight, Japan
Products
  • High Thermal Conductive Insulating Adhesion Sheet for Power Devices
  • Transient Liquid Phase Sintering Paste
Official Web Site

18th IC PACKAGING TECHNOLOGY EXPO

Dates January 18 (Wed) - 20 (Fri), 2017
Location Tokyo Big Sight, Tokyo, Japan
Description
  • Semiconductor Package Related Materials
  • New Materials
  • Materials for Wearable / Display / IoT
  • Printed Wiring Boards
Official Web Site

SEMICON Japan

Dates December 14 (Wed) - 16 (Fri.), 2016
Location Tokyo Big Sight, Tokyo, Japan
Description
  • Semiconductor Packaging Material
  • Stretchable Insulating Material
Official Web Site

JPCA Show 2016(46th International Electronic Circuits Exhibition)

Dates June 1st (Wed) - 3rd (Fri) 2016
Location Tokyo Big Sight, Japan
Description Base Materials
  • Base Materials for ICT Infrastructure
  • Base Materials for IoT/Smartphone PKG Module
  • Base Materials for ASV
Photosensitive Dry Film
  • Process Materials
  • Insulation Materials
Equipment for PWB and PWB Rerated Materials
  • Laminator / Others
NPI Presentation
  • New Low Transmission Loss & Low CTE Material "MCL-HS100" for Next Generation High Frequency Applications
Official Web Site

1st CERAMICS JAPAN - Highly-functional Ceramics Expo

Dates April 6 (Wed.) - 8 (Fri.), 2016
Location Tokyo Big Sight, Japan
Products
  • High Thermal Conductive Insulating Adhesion Sheet for Power Devices
  • Super Thick Copper PWB for High Current Power Devices
  • Low Temperature Sintering, High Thermal Resistance after Sintering
Official Web Site

GLOBE 2016

Dates March 2 (Wed.) - 4 (Fri.), 2016
Location East Building of the Vancouver Convention Centre in Canada
Description
  • CO2 Solid Adsorbent & Recovery Devices
  • Inorganic Thermal Insulator
  • Wavelength Conversion Particle
  • Suspended Particle Device Films
  • Lithium Ion Batteries for Industrial Use
Official Web Site

nano tech 2016 - The 15th International Nanotechnology Exhibition & Conference

Dates January 27 (Wed.) - 29 (Fri.), 2016
Location Tokyo Big Sight, JAPAN
Description
  • Porous Metal
  • Copper Paste for Metal Bonding
  • Inorganic-Organic Hybrid Porous Material
  • Transparent Thermally Stable Polymer
  • Transparent Tough Polymer
  • Composite Particle
Official Web Site

17th IC PACKAGING TECHNOLOGY EXPO

Dates January 13 (Wed.) - 15 (Fri.), 2016
Location Tokyo Big Sight, JAPAN
Description
  • New Materials
  • Materials for Semiconductor Packages
  • Printed Wiring Boards
  • Materials for PWB's Assembly
  • Materials for PWBs
Official Web Site

CHINA COAT 2015

Dates November 18 (Wed.) - 20 (Fri.) 2015
Location Shanghai New International Expo Centre(SNIEC) Shanghai, China
Description
  • Functional (meth) acrylate
  • Acrylic resins for coating
  • UV-curable resins for coatings and display
  • Polyurethane resins for gravure inks
  • High heat resistant resin
  • Over coating materials Tuffy series
Official Web Site

TPCA Show 2015 in Taiwan

Dates October 21 (Wed.) - 23 (Fri.) 2015
Location Taipei Nangang Exhibition Center, Taiwan
Description MCL materials
  • PGK application
  • HDI application
  • Network application
Photec&Solder mask
Capacitor
Probe card
Official Web Site

CommunicAsia2015

Dates June 2 (Tue.) - 5 (Fri.)
Location Marina Bay Sands, Singapore
Description Energy Storage Devices
Official Web Site

JPCA Show 2015 (45th International Electronic Circuits Exhibition)

Dates June 3rd (Wed) - 5th (Fri) 2015
Location Tokyo Big Sight, Japan
Description Base Materials
  • Base materials for ICT interstructure equipment
  • Base materials for semiconductor packages
  • Base materials for automobile and smartphones
Process Materials
  • Photosensitive Materials
Equipment for PWB and PWB Related Materials
  • Laminator / Others
NPI Presentation
  • Ultra low CTE core material for APU(FC-CSP) application "MCL-E-770G"
  • Material to reduce solder crack for automotive application "TD-002"
Official Web Site

15th FIBER OPTICS EXPO – FOE 2015

Dates April 8 (Wed) - 10 (Fri) 2015
Location Tokyo Big Sight, Japan
Description
  • Mixing Waveguide of Multi-mode
  • Waveguide Substrate with Fiber Guide Trench & Technology
Official Web Site
  • Page Top

Page Link