Events & Exhibition

Events & Exhibition

starting of main content

Schedule

10th China International Chemical Industry Fair (ICIF China 2010)

Dates: Sep.15(Wed) - Sep.17(Fri), 2010. 9:30–17:00 (Sep.17 9:30–15:00)
Location: Shanghai New International Expo Center (SNIEC), China (Booth No.W3B01, Hall W3)
* We recommend that you make pre-registration as a visitor on the official site.
Description:
Epoxy resin hardeners
Functional acrylic monomers
Insulating varnishes
Acrylic resins
Photo curable materials
Polyurethane resins*
Moisture-curing polyurethane adhesives*
Reactive solvent-based adhesives*
* Production & sales by Hitachi Kasei Polymer Co.,Ltd.
 

Past Events & Exhibition

JPCA Show 2010

Dates: June 2(Wed) - 4(Fri) 2010, 10:00 - 17:00(-16:00 on the final day)
Location: Tokyo Big Sight Japan(Booth No. 6B-15 East hall 6)
Description:
Base Materials
High Thermal Conductive Materials
High Frequency Multilayer Materials
Base Materials for Semiconductor Package
Enhanced FR-4 Multilayer Materials
Optical Waveguide Film Materials
Process Materials
Electroless Gold Plating Chemicals
Photosensitive Dry Film
 

2nd LED/OLED Lighting Technology EXPO (LIGHTING JAPAN)

Dates: April 14 (Wed.) - 16 (Fri.), 2010  10:00 - 18:00 (10:00 - 17:00 on April 16)
Location: Tokyo Big Sight, JAPAN (Booth No. L11-20, East Hall 3)
Description:
Thermal Conductive Sheet
Thermally Conductive Multilayer Material
Low Thermal Resistance FPC Material
Thermally Conductive Adhesive “Hi-Bon”
High Light Reflective Aluminum PWB for LED Illumination
 

11th IC PACKAGING TECHNOLOGY EXPO

Dates: January 20 to 22, 2010 10:00-18:00 (10:00-17:00 on Jan.22)
Location: Tokyo Big Sight, Japan (East Exhibition Hall 2, No.East 17-44)
Description:
High-End Multilayer Material and Insulation Film for various package substrates
High thermal Conductive Multilayer Material for package substrates
Photosensitive Solder Resist Film "RAYTEC"
Photosensitive Dry Film "PHOTEC"
Epoxy Molding Compounds for semiconductor package "CEL" series
Die Bonding Film suitable for various semiconductor manufacturing process  "FH" series
Connection Film Alternative to Solder "MF" series
Thermally Conductive Materials
 

ECO-Products 2009

Dates: December 10 (Thu.) - December 12 (Sat.)10:00-18:00(Sat.-17:00)
Location: Tokyo Big Sight Japan(HITACHI Booth No.3-027 East hall 3)
Description: Suspended Particle Device "SPD Film"
 

SEMICON Japan 2009

Dates: December 2 (Wed.) - December 4 (Fri.) 10:00-17:00
Location: Makuhari Messe, JAPAN (Booth No. 5A-104, Hall5)
Description:
CMP Slurry
Epoxy Molding Compounds
Die Bonding Materials
High Heat Resistance Fine Polyimides for VLSI
Conection Film Alternative to Solder
Multi Wiring Board for Probe Card
Thermally Conductive Materials
 

FPD International 2009

Dates: October 28 (Wed.) - October 30 (Fri.) 10:00-17:00
Location: Pacifico Yokohama, JAPAN (Booth No. 1103, B hall)
Description:
Materials for Flat Panel Display:
Anisotropic Conductive Film
Conformal Coating Materials
Optical Film
Thermally Conductive Materials
 
ending of main content