Schedule
| Dates: |
April 14 (Wed.) - 16 (Fri.), 2010 10:00 - 18:00 (10:00 - 17:00 on April 16) |
| Location: |
Tokyo Big Sight, JAPAN (Booth No. L11-20, East Hall 3)
* We recommend that you make pre-registration as a visitor on the official site. |
| Description: |
- Thermal Conductive Sheet
- Thermally Conductive Multilayer Material
- Low Thermal Resistance FPC Material
- Thermally Conductive Adhesive “Hi-Bon”
- High Light Reflective Aluminum PWB for LED Illumination
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Past Events & Exhibition
| Dates: |
January 20 to 22, 2010 10:00-18:00 (10:00-17:00 on Jan.22) |
| Location: |
Tokyo Big Sight, Japan (East Exhibition Hall 2, No.East 17-44) |
| Description: |
- High-End Multilayer Material and Insulation Film for various package substrates
- High thermal Conductive Multilayer Material for package substrates
- Photosensitive Solder Resist Film "RAYTEC"
Photosensitive Dry Film "PHOTEC"
- Epoxy Molding Compounds for semiconductor package "CEL" series
- Die Bonding Film suitable for various semiconductor manufacturing process "FH" series
- Connection Film Alternative to Solder "MF" series
- Thermally Conductive Materials
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ECO-Products 2009
| Dates: |
December 10 (Thu.) - December 12 (Sat.)10:00-18:00(Sat.-17:00) |
| Location: |
Tokyo Big Sight Japan(HITACHI Booth No.3-027 East hall 3) |
| Description: |
Suspended Particle Device "SPD Film" |
| Dates: |
December 2 (Wed.) - December 4 (Fri.) 10:00-17:00 |
| Location: |
Makuhari Messe, JAPAN (Booth No. 5A-104, Hall5) |
| Description: |
- CMP Slurry
- Epoxy Molding Compounds
- Die Bonding Materials
- High Heat Resistance Fine Polyimides for VLSI
- Conection Film Alternative to Solder
- Multi Wiring Board for Probe Card
- Thermally Conductive Materials
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| Dates: |
October 28 (Wed.) - October 30 (Fri.) 10:00-17:00 |
| Location: |
Pacifico Yokohama, JAPAN (Booth No. 1103, B hall) |
| Description: |
- Materials for Flat Panel Display:
- Anisotropic Conductive Film
- Conformal Coating Materials
- Optical Film
- Thermally Conductive Materials
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| Dates: |
June 3(Wed) - 5(Fri) 2009, 10:00 - 17:00(-16:00 on the final day) |
| Location: |
Tokyo Big Sight Japan(Booth No. 2P-17, 2P-14 East hall 2) |
| Description: |
- Base Materials:
- Base Materials for semiconductor package
- High Frequency Multilayer Materials
- Enhanced FR-4 Multilayer Materials etc.
- Process Materials:
- Electroless Gold Plating Chemicals
- Photosensitive Dry Film
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