Events & Exhibition
Events & Exhibition
Schedule
| Dates: |
February 15(Wed.) - 17 (Fri.), 2012 10:00 - 17:00 |
| Location: |
Tokyo Big Sight, Tokyo, Japan (Booth No. E-37, East Hall5) |
| * We recommend that you make pre-registration as a visitor on the official site. |
| Description: |
- Carbon Nanotube (CNT)
- Copper ink
- Biocompatible nano-sheet
- etc.
|
Past Events & Exhibition
| Dates: |
January 18 (Wed) - 20 (Fri), 2012, 10:00-18:00 (10:00-17:00 on Jan. 20) |
| Location: |
Tokyo Big Sight, Tokyo, Japan
(Booth No. West L1-64, West Hall1) |
| Description: |
LED Package Materials:
- White Reflector Laminates
- Pattern Plating Transfer (PPT) Process PWB
- White Reflection Molding Compounds
- UV Curable Dam Materials
- Coating Materials to Prevent Sulfurization of Ag
LED Substrate Materials:
- Low Heat Resistance Substrate Materials
- Substrate Materials for Multi Layer PWB
- High Heat Conductivity Adhesive Sheet
- Cutting Substrate Materials
LED Products Assembly Materials:
- Heat Conductive Adhesive Sheets
- Heat Dissipation Coating Materials
|
The 42nd Tokyo Motor Show 2011
| Dates: |
December 3 (Sat.) - 11 (Sun.) |
| Hours: |
Monday - Saturday 10:00 - 20:00, Sunday 10:00 - 18:00 *only for Dec.11 10:00-17:00 |
| Location: |
Tokyo Big Sight, Japan
(East Hall 6, Booth No. E6101) |
| Description: |
- "Parts & Materials for Eco-Car"
- 1) Thermal Management
Thermoelectric Module, Porous Materials, Highly Thermal Conductive Sheet, SPD (Suspended Particle Device) Film
- 2) Tribology
Powdered Metal Parts (Reactor Assey,Valve Timing Control, Valve Guide / Valve Sheet),etc
- 3) Recycle
|
| Dates: |
December 7(Wed.) - 9(Fri.) 10:00-17:00 |
| Location: |
Makuhari Messe, Japan
(Hall 5 Booth-No.5B-201) |
| Description: |
- CMP Slurry
- HDM Polyimide Coatings
- Die Bonding Film
- Photo-sensitive Die Bonding Film
- Under Fill Materials
- White Epoxy Molding Compound for LED Packaging
- PWB for Probe Card
|
CHINA COAT 2011
| Dates: |
November 23 (Wed.) - 25 (Fri.)
*November 23(Wed.) 9:00-12:00 : Pre-registered and VIP visitors only
*November 23(Wed.) 12:00-17, 24(Thu) 9:00-17:00, 25(Fri.) 9:00-14:00 : for all visitors |
| Location: |
Shanghai New International Expo Center (SNIEC) ,China
(Hall E4 Booth-No.4C21-25) |
| Description: |
- Functional Acrylate
- Hard-Coating Materials for Plastics
- UV-Curing Adhesives
- Acrylic Resins for Paints
- Amino Resins for Paints
- Polyurethane Resins for Gravure Inks
|
SEMICON Taiwan 2011
| Dates: |
September 7 (Wed.) - 9 (Fri.) 10:00-17:00 (Sep. 9 10:00-16:00) |
| Location: |
Taipei World Trade Center, Taiwan
(Hall 1 Booth-No.2228) |
| Description: |
- CMP Slurry
- Die Bonding Film
- Photosensitive Die Attach Film
- Support Film
- Interconnection Paste / Conductive Film
- Epoxy Molding Compounds
- Liquid Encapsulant
- White Molding Compound for LED
- Base Materials for PWBs
- Probe Card
|
26th European Photovoltaic Solar Energy Conference and Exhibition (PVSEC2011)
| Dates: |
September 5 (Mon.) - 8 (Thu.) 9:00-18:00 |
| Location: |
CCH Congress Centre and International Fair Hamburg, Germany
(Hall B1 Booth-No.B1U/C15) |
| Description: |
- Conductive Film
- Interconnecting Paste
- Insulating Paste
|
Display Taiwan 2011
| Dates: |
June 14 (Tue.) - 16 (Thur.) 10:00-17:30 |
| Location: |
Taipei World Trade Center, Taiwan
(Nangang Exhibition Hall 1F Booth-No.I211) |
| Description: |
- Material for Interlayer of Touch Panel & Display
- Optically Clear Adhesive Film/Liquid "FINESET"
- Materials for Connecting Circuits and Packaging
- Anisotropic Conductive Film "ANISOLM" &"MF Series"
- Conductive Film for Photovoltaic Cells "CF Series"
- Conformal Coating Material "TUFFY"
- Optical Film for Back Light Unit
- Diffraction Type Light Condenser Film
- Coating Materials
- Hard Coating Material for Plastics "HITALOID"
|
| Dates: |
June 1(Wed) - 3(Fri) 2011, 10:00 - 17:00 |
| Location: |
Tokyo Big Sight Japan(Booth No.2E-07,2D-10 East hall 2) |
| Description: |
- Base Materials:
- Base materials for Semiconductor Package
- Base materials for High Frequency Application
- Enhanced FR-4 Multilayer Materials
- High Thermal Conductive Materials
- Process Materials:
- Electroless Gold Plating Chemicals
- Photosensitive Dry Film & Resist
|
| Dates: |
January 19 (Wed) - 21 (Fri), 2011 (10:00-17:00 on Jan. 21) |
| Location: |
Tokyo Big Sight, Tokyo, Japan(Booth No.EAST 18-47 , East Hall 2) |
| Description: |
- High-End Multilayer Material for various package substrates,"MCL-E-700G(R)series"
- Low CTE and Low Surface Roughness Halogen-Free Insulation Films, AS-Z4"(Halogen-Free Insulation Film) /"SAPP" (Semi-Additive Process Primer)
- Photosensitive Solder Resist,"SR-7300G
- Photosensitive Solder Resist Film,"FZ-2700Gseries"
- Epoxy Molding Compounds for semiconductor package "CEL" series
- Liquid Encapsulant for semiconductor package "CEL-C" series
- White Molding Compounds for LED package "CEL-W" series
|
| Dates: |
January 19 (Wed) - 21 (Fri), 2011 10:00-18:00 (10:00-17:00 on Jan. 21) |
| Location: |
Tokyo Big Sight, Tokyo, Japan (Booth No. West 7-1, West Hall1) |
| Description: |
- Thermally Conductive Substrate Material
- Low Thermal Resistance FPC Material
- Thermally Conductive Adhesive Sheet/Tape
- LED Package Material
- Heat Dispersion Coating Material
- Optical Light Guide Film
|
| Dates: |
December 1 (Wed.) - December 3 (Fri.) 10:00-17:00 |
| Location: |
Makuhari Messe, JAPAN (Booth No.5B-201, Hall5) |
| Description: |
- CMP Slurry for STI/Metal "GPX"
- Photo-sensitive Die Bonding Film
- Novel Paste Materials for Electronic Devices
- Printable Die Bonding Paste
- Epoxy Molding Compounds
- Liquid Encapsulants
- White Molding Compounds
- HDM Polyimide Coatings
- Package Substrate for POP
- Environmentally-compatible Low-melting Vanadate Glasses "Vaneetect"
|
| Dates: |
November 10 (Wed.) - November 12 (Fri.) 10:00-17:00 |
| Location: |
Makuhari Messe, Japan (Booth No. 4721, Hall 4) |
| Description: |
- Optical Materials
- Optically Clear Adhesive "FINESET "
- Diffraction Type Light Condenser Film
- Anti-reflection (AR) Coating Clear Sheet
- Hard Coating Material for Plastics "HITALOID"
- Materials for Connecting Circuits and Packaging
- Anisotropic Conductive Film "ANISOLM " & "MF Series "
- Conformal Coating Material "TUFFY "
- Conductive Film
- Transparent Conductive Transfer Film
- Process Materials
- Supporting Film for Touch Panel Parts "HITALEX "
|
10th China International Chemical Industry Fair (ICIF China 2010)
| Dates: |
Sep.15(Wed) - Sep.17(Fri), 2010. 9:00-17:00 (Sep.17 9:00-15:00) |
| Location: |
Shanghai New International Expo Center (SNIEC), China (Booth No.W3B01, Hall W3) |
| Description: |
- Epoxy resin hardeners
- Functional acrylic monomers
- Insulating Varnishes
- Acrylic resins
- Photo curable materials
- Polyurethane resins*
- Moisture-curing polyurethane adhesives*
- Reactive solvent-based adhesives*
* Production & sales by Hitachi Kasei Polymer Co.,Ltd. |
| Dates: |
June 2(Wed) - 4(Fri) 2010, 10:00 - 17:00(-16:00 on the final day) |
| Location: |
Tokyo Big Sight Japan(Booth No. 6B-15 East hall 6) |
| Description: |
- Base Materials
- High Thermal Conductive Materials
- High Frequency Multilayer Materials
- Base Materials for Semiconductor Package
- Enhanced FR-4 Multilayer Materials
- Optical Waveguide Film Materials
- Process Materials
- Electroless Gold Plating Chemicals
- Photosensitive Dry Film
|
| Dates: |
April 14 (Wed.) - 16 (Fri.), 2010 10:00 - 18:00 (10:00 - 17:00 on April 16) |
| Location: |
Tokyo Big Sight, JAPAN (Booth No. L11-20, East Hall 3) |
| Description: |
- Thermal Conductive Sheet
- Thermally Conductive Multilayer Material
- Low Thermal Resistance FPC Material
- Thermally Conductive Adhesive “Hi-Bon”
- High Light Reflective Aluminum PWB for LED Illumination
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