Events & Exhibition

Events & Exhibition

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Schedule

nano tech 2012 - The 11th International Nanotechnology Exhibition & Conference

Dates: February 15(Wed.) - 17 (Fri.), 2012 10:00 - 17:00
Location: Tokyo Big Sight, Tokyo, Japan (Booth No. E-37, East Hall5)
* We recommend that you make pre-registration as a visitor on the official site.
Description:
Carbon Nanotube (CNT)
Copper ink
Biocompatible nano-sheet
etc.
 

Past Events & Exhibition

LIGHTING JAPAN–4rd LED/OLED Lighting Technology Expo

Dates: January 18 (Wed) - 20 (Fri), 2012, 10:00-18:00 (10:00-17:00 on Jan. 20)
Location: Tokyo Big Sight, Tokyo, Japan
(Booth No. West L1-64, West Hall1)
Description: LED Package Materials:
White Reflector Laminates
Pattern Plating Transfer (PPT) Process PWB
White Reflection Molding Compounds
UV Curable Dam Materials
Coating Materials to Prevent Sulfurization of Ag
LED Substrate Materials:
Low Heat Resistance Substrate Materials
Substrate Materials for Multi Layer PWB
High Heat Conductivity Adhesive Sheet
Cutting Substrate Materials
LED Products Assembly Materials:
Heat Conductive Adhesive Sheets
Heat Dissipation Coating Materials
 

The 42nd Tokyo Motor Show 2011

Dates: December 3 (Sat.) - 11 (Sun.)
Hours: Monday - Saturday 10:00 - 20:00, Sunday 10:00 - 18:00 *only for Dec.11 10:00-17:00
Location: Tokyo Big Sight, Japan
(East Hall 6, Booth No. E6101)
Description:
"Parts & Materials for Eco-Car"
  • 1) Thermal Management
    Thermoelectric Module, Porous Materials, Highly Thermal Conductive Sheet, SPD (Suspended Particle Device) Film
  • 2) Tribology
    Powdered Metal Parts (Reactor Assey,Valve Timing Control, Valve Guide / Valve Sheet),etc
  • 3) Recycle
 

SEMICON Japan 2011

Dates: December 7(Wed.) - 9(Fri.) 10:00-17:00
Location: Makuhari Messe, Japan
(Hall 5 Booth-No.5B-201)
Description:
CMP Slurry
HDM Polyimide Coatings
Die Bonding Film
Photo-sensitive Die Bonding Film
Under Fill Materials
White Epoxy Molding Compound for LED Packaging
PWB for Probe Card
 

CHINA COAT 2011

Dates: November 23 (Wed.) - 25 (Fri.)
*November 23(Wed.) 9:00-12:00 : Pre-registered and VIP visitors only *November 23(Wed.) 12:00-17, 24(Thu) 9:00-17:00, 25(Fri.) 9:00-14:00 : for all visitors
Location: Shanghai New International Expo Center (SNIEC) ,China
(Hall E4 Booth-No.4C21-25)
Description:
Functional Acrylate
Hard-Coating Materials for Plastics
UV-Curing Adhesives
Acrylic Resins for Paints
Amino Resins for Paints
Polyurethane Resins for Gravure Inks
 

SEMICON Taiwan 2011

Dates: September 7 (Wed.) - 9 (Fri.) 10:00-17:00 (Sep. 9 10:00-16:00)
Location: Taipei World Trade Center, Taiwan
(Hall 1 Booth-No.2228)
Description:
CMP Slurry
Die Bonding Film
Photosensitive Die Attach Film
Support Film
Interconnection Paste / Conductive Film
Epoxy Molding Compounds
Liquid Encapsulant
White Molding Compound for LED
Base Materials for PWBs
Probe Card
 

26th European Photovoltaic Solar Energy Conference and Exhibition (PVSEC2011)

Dates: September 5 (Mon.) - 8 (Thu.) 9:00-18:00
Location: CCH Congress Centre and International Fair Hamburg, Germany
(Hall B1 Booth-No.B1U/C15)
Description:
Conductive Film
Interconnecting Paste
Insulating Paste
 

Display Taiwan 2011

Dates: June 14 (Tue.) - 16 (Thur.) 10:00-17:30
Location: Taipei World Trade Center, Taiwan
(Nangang Exhibition Hall 1F Booth-No.I211)
Description:
Material for Interlayer of Touch Panel & Display
Optically Clear Adhesive Film/Liquid "FINESET"
Materials for Connecting Circuits and Packaging
Anisotropic Conductive Film  "ANISOLM" &"MF Series"
Conductive Film for Photovoltaic Cells "CF Series"
Conformal Coating Material "TUFFY"
Optical Film for Back Light Unit
Diffraction Type Light Condenser Film
Coating Materials
Hard Coating Material for Plastics "HITALOID"
 

JPCA Show 2011

Dates: June 1(Wed) - 3(Fri) 2011, 10:00 - 17:00
Location: Tokyo Big Sight Japan(Booth No.2E-07,2D-10 East hall 2)
Description:
Base Materials:
Base materials for Semiconductor Package
Base materials for High Frequency Application
Enhanced FR-4 Multilayer Materials
High Thermal Conductive Materials
Process Materials:
Electroless Gold Plating Chemicals
Photosensitive Dry Film & Resist
 

12th IC PACKAGING TECHNOLOGY EXPO

Dates: January 19 (Wed) - 21 (Fri), 2011 (10:00-17:00 on Jan. 21)
Location: Tokyo Big Sight, Tokyo, Japan(Booth No.EAST 18-47 , East Hall 2)
Description:
High-End Multilayer Material for various package substrates,"MCL-E-700G(R)series"
Low CTE and Low Surface Roughness Halogen-Free Insulation Films, AS-Z4"(Halogen-Free Insulation Film) /"SAPP" (Semi-Additive Process Primer)
Photosensitive Solder Resist,"SR-7300G
Photosensitive Solder Resist Film,"FZ-2700Gseries"
Epoxy Molding Compounds for semiconductor package "CEL" series
Liquid Encapsulant for semiconductor package "CEL-C" series
White Molding Compounds for LED package "CEL-W" series
 

LIGHTING JAPAN-3rd LED/OLED Lighting Technology Expo

Dates: January 19 (Wed) - 21 (Fri), 2011 10:00-18:00 (10:00-17:00 on Jan. 21)
Location: Tokyo Big Sight, Tokyo, Japan (Booth No. West 7-1, West Hall1)
Description:
Thermally Conductive Substrate Material
Low Thermal Resistance FPC Material
Thermally Conductive Adhesive Sheet/Tape
LED Package Material
Heat Dispersion Coating Material
Optical Light Guide Film
 

SEMICON Japan 2010

Dates: December 1 (Wed.) - December 3 (Fri.) 10:00-17:00
Location: Makuhari Messe, JAPAN (Booth No.5B-201, Hall5)
Description:
CMP Slurry for STI/Metal "GPX"
Photo-sensitive Die Bonding Film
Novel Paste Materials for Electronic Devices
Printable Die Bonding Paste
Epoxy Molding Compounds
Liquid Encapsulants
White Molding Compounds
HDM Polyimide Coatings
Package Substrate for POP
Environmentally-compatible Low-melting Vanadate Glasses "Vaneetect"
 

FPD International 2010

Dates: November 10 (Wed.) - November 12 (Fri.) 10:00-17:00
Location: Makuhari Messe, Japan (Booth No. 4721, Hall 4)
Description:
Optical Materials
Optically Clear Adhesive "FINESET "
Diffraction Type Light Condenser Film
Anti-reflection (AR) Coating Clear Sheet
Hard Coating Material for Plastics "HITALOID"
Materials for Connecting Circuits and Packaging
Anisotropic Conductive Film "ANISOLM " & "MF Series "
Conformal Coating Material "TUFFY "
Conductive Film
Transparent Conductive Transfer Film
Process Materials
Supporting Film for Touch Panel Parts "HITALEX "
 

10th China International Chemical Industry Fair (ICIF China 2010)

Dates: Sep.15(Wed) - Sep.17(Fri), 2010. 9:00-17:00 (Sep.17 9:00-15:00)
Location: Shanghai New International Expo Center (SNIEC), China (Booth No.W3B01, Hall W3)
Description:
Epoxy resin hardeners
Functional acrylic monomers
Insulating Varnishes
Acrylic resins
Photo curable materials
Polyurethane resins*
Moisture-curing polyurethane adhesives*
Reactive solvent-based adhesives*
* Production & sales by Hitachi Kasei Polymer Co.,Ltd.
 

JPCA Show 2010

Dates: June 2(Wed) - 4(Fri) 2010, 10:00 - 17:00(-16:00 on the final day)
Location: Tokyo Big Sight Japan(Booth No. 6B-15 East hall 6)
Description:
Base Materials
High Thermal Conductive Materials
High Frequency Multilayer Materials
Base Materials for Semiconductor Package
Enhanced FR-4 Multilayer Materials
Optical Waveguide Film Materials
Process Materials
Electroless Gold Plating Chemicals
Photosensitive Dry Film
 

2nd LED/OLED Lighting Technology EXPO (LIGHTING JAPAN)

Dates: April 14 (Wed.) - 16 (Fri.), 2010  10:00 - 18:00 (10:00 - 17:00 on April 16)
Location: Tokyo Big Sight, JAPAN (Booth No. L11-20, East Hall 3)
Description:
Thermal Conductive Sheet
Thermally Conductive Multilayer Material
Low Thermal Resistance FPC Material
Thermally Conductive Adhesive “Hi-Bon”
High Light Reflective Aluminum PWB for LED Illumination
 
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