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Events & Exhibition

Schedule

 

Past Events & Exhibition

JPCA Show 2018 (48th International Electronic Circuits Exhibition)

Dates June 6th (Wed) - 8th (Fri), 2018
Location Tokyo Big Sight, Japan
Description Base Materials
  • Base Materials for Packages
  • Base Materials for ICT Infrastructure / IoT Applications
  • Base Materials for Automotive /ADAS applications
Photosensitive Materials
  • Photosensitive Materials for Fine Patterning
  • Photosensitive Insulation Materials for Packages
Open Laboratory
NPI Presentation Low CTE, Low Modulus Prepreg for Next Generation PKG Applications "GEA-775G"
Official Web Site

American Coating Show

Dates April 10 (Tue) - 12 (Thu), 2018
Location Indiana Convention Center, Indianapolis, IN, USA
Description
  • Fanctional Acrylic Resins
  • UV-curable Materials
  • Epoxy Resin Hardeners
  • Heat Resistant Resin (Polyamide-imide)
Official Web Site

4th Advanced Digital Technology Expo in CONTENT TOKYO 2018

Dates Apr. 4 (Wed) 6 (Fri)
Venue & Booth No. Tokyo Big Sight
Description
  • Light Integrator for AR Device
  • Light Integrator for Health Care
We will exhibit light integrator which realize the 1/2 of light mixing part volume compare to that of dichroic mirror method.
Official Web Site

GLOBE Forum 2018

Dates 2018 Mar 14 (Wed) - Mar 16 (Fri)
Venue & Booth No. Vancouver Conference Centre, East Building, Vancouver, Canada
Description Ceria based CO2 adsorbent effective even under co-existence of water for CCS
Official Web Site

HVAC&R JAPAN 2018 HEATING, VENTILATING, AIR-CONDITIONING AND REFRIGERATING EXPO

Dates Feb. 27 (Tue) - Mar. 2 (Fri), 2018
Location Makuhari Messe, Japan
Description
  • Coatable Thermal Insulating Material
  • Latent Thermal Storage Materials
  • CO2Adsorbent
Official Web Site

nano tech 2018 - The 17th International Nanotechnology Exhibition & Conference

Dates Feb. 14 (Wed) - 16 (Fri.), 2018
Location Tokyo Big Sight, Japan
Description
  • Stimuli-responsive Material
  • Copper Clad Stretchable/Flexible Film
  • Cu Paste for 3D-MID (Molded Interconnect Devices)
  • Cu Bonding Paste that can be Sintered without Pressure
  • Coatable Thermal Insulating Material
  • Latant Thermal Storage Materials
Official Web Site

CAR-ELE JAPAN-10th Int'l Automotive Electronics Technology Expo

Dates Jan. 17th(Wed) - 19th (Fri), 2018
Location Tokyo Big Sight, Japan
Products
  • High Thermal Resistant Epoxy Molding Compound
  • High Thermal Resistant Encapsulant for Case Module
  • Sintering Cu bonding paste
  • Low Elastic Transient Liquid Phase Sintering Paste
  • Resin Insulated Thick Copper Substrate for High Current Power Device
  • High Heat Resistant Insulating Coating Materials
  • Thermal Conductive Sheet Materials Containing Vertically
Official Web Site

19th IC & Sensor Packaging Technology Expo in NEPCON JAPAN 2018

Dates Jan. 17 (Wed) Jan. 19 (Fri), 2018
Location Tokyo Big Sight
Description
  • Photosensitive Insulation Film for Encapsulation and Embedding PX-1000
  • Low Transmission Loss Build-up Film AS-500HS
  • Low Transmission Loss Build-up Film AS-400HS
  • Low Transmission Loss / Low CTE Materials MCL-HS100
  • Encapsulation Material for High Frequency Devices CEL-X-DF series
  • Stretchable Substrate Material

SEMICON Japan

Dates December 13 (Wed) - 15 (Fri.), 2017
Location Tokyo Big Sight, Tokyo, Japan
Description
  • Advanced Materials for Next-generation High Speed Communication
  • Insulation Material for Wearable Device
  • Conductive Materials for Automotive Electical Equipment
  • Open Innovation Activity for Semiconductor Packages
Official Web Site

LED Japan 2017 (in All about Photonics)

Dates October 4 (Wed.)-6 (Fri.), 2017
Location Makuhari Messe
Description
  • Light mixing integrator
This product can emit an uniform light by scattering and integration of LED or LD-RGB light source.

Advantage 1: Compact design in the light mixing part.
Advantage 2: Realization of high color uniformity.
Advantage 3: Bright image with high light source utilization efficiency.

Technical Contents: Combination of Mie scattering and enclosure of light.
Official Web Site

JPCA Show 2017 (47th International Electronic Circuits Exhibition)

Dates June 7th (Wed) - 9th (Fri) 2017
Location Tokyo Big Sight, Japan
Description Open Laboratory Solution
  • Introduction of Hitachi Chemical Open Laboratory
Base Materials
  • Base Materials for Packages and Modules
  • Copper Clad Stretchable/Flexible Film
Photosensitive Dry Film
  • Photosensitive Materials for Fine Patterning
  • Photosensitive Insulation Materials
Equipment for PWB and PWB related Materials
  • Laminator/Others
Official Web Site

2nd CERAMICS JAPAN - Highly-functional Ceramics Expo

Dates April 5(Wed.) - 7(Fri.), 2017
Location Tokyo Big Sight, Japan
Products
  • High Thermal Conductive Insulating Adhesion Sheet for Power Devices
  • Transient Liquid Phase Sintering Paste
Official Web Site

18th IC PACKAGING TECHNOLOGY EXPO

Dates January 18 (Wed) - 20 (Fri), 2017
Location Tokyo Big Sight, Tokyo, Japan
Description
  • Semiconductor Package Related Materials
  • New Materials
  • Materials for Wearable / Display / IoT
  • Printed Wiring Boards

SEMICON Japan

Dates December 14 (Wed) - 16 (Fri.), 2016
Location Tokyo Big Sight, Tokyo, Japan
Description
  • Semiconductor Packaging Material
  • Stretchable Insulating Material
Official Web Site

JPCA Show 2016(46th International Electronic Circuits Exhibition)

Dates June 1st (Wed) - 3rd (Fri) 2016
Location Tokyo Big Sight, Japan
Description Base Materials
  • Base Materials for ICT Infrastructure
  • Base Materials for IoT/Smartphone PKG Module
  • Base Materials for ASV
Photosensitive Dry Film
  • Process Materials
  • Insulation Materials
Equipment for PWB and PWB Rerated Materials
  • Laminator / Others
NPI Presentation
  • New Low Transmission Loss & Low CTE Material "MCL-HS100" for Next Generation High Frequency Applications
Official Web Site

1st CERAMICS JAPAN - Highly-functional Ceramics Expo

Dates April 6 (Wed.) - 8 (Fri.), 2016
Location Tokyo Big Sight, Japan
Products
  • High Thermal Conductive Insulating Adhesion Sheet for Power Devices
  • Super Thick Copper PWB for High Current Power Devices
  • Low Temperature Sintering, High Thermal Resistance after Sintering
Official Web Site

GLOBE 2016

Dates March 2 (Wed.) - 4 (Fri.), 2016
Location East Building of the Vancouver Convention Centre in Canada
Description
  • CO2 Solid Adsorbent & Recovery Devices
  • Inorganic Thermal Insulator
  • Wavelength Conversion Particle
  • Suspended Particle Device Films
  • Lithium Ion Batteries for Industrial Use
Official Web Site

nano tech 2016 - The 15th International Nanotechnology Exhibition & Conference

Dates January 27 (Wed.) - 29 (Fri.), 2016
Location Tokyo Big Sight, JAPAN
Description
  • Porous Metal
  • Copper Paste for Metal Bonding
  • Inorganic-Organic Hybrid Porous Material
  • Transparent Thermally Stable Polymer
  • Transparent Tough Polymer
  • Composite Particle
Official Web Site

17th IC PACKAGING TECHNOLOGY EXPO

Dates January 13 (Wed.) - 15 (Fri.), 2016
Location Tokyo Big Sight, JAPAN
Description
  • New Materials
  • Materials for Semiconductor Packages
  • Printed Wiring Boards
  • Materials for PWB's Assembly
  • Materials for PWBs
Official Web Site

CHINA COAT 2015

Dates November 18 (Wed.) - 20 (Fri.) 2015
Location Shanghai New International Expo Centre(SNIEC) Shanghai, China
Description
  • Functional (meth) acrylate
  • Acrylic resins for coating
  • UV-curable resins for coatings and display
  • Polyurethane resins for gravure inks
  • High heat resistant resin
  • Over coating materials Tuffy series
Official Web Site

TPCA Show 2015 in Taiwan

Dates October 21 (Wed.) - 23 (Fri.) 2015
Location Taipei Nangang Exhibition Center, Taiwan
Description MCL materials
  • PGK application
  • HDI application
  • Network application
Photec&Solder mask
Capacitor
Probe card
Official Web Site

CommunicAsia2015

Dates June 2 (Tue.) - 5 (Fri.)
Location Marina Bay Sands, Singapore
Description Energy Storage Devices
Official Web Site

JPCA Show 2015 (45th International Electronic Circuits Exhibition)

Dates June 3rd (Wed) - 5th (Fri) 2015
Location Tokyo Big Sight, Japan
Description Base Materials
  • Base materials for ICT interstructure equipment
  • Base materials for semiconductor packages
  • Base materials for automobile and smartphones
Process Materials
  • Photosensitive Materials
Equipment for PWB and PWB Related Materials
  • Laminator / Others
NPI Presentation
  • Ultra low CTE core material for APU(FC-CSP) application "MCL-E-770G"
  • Material to reduce solder crack for automotive application "TD-002"
Official Web Site

15th FIBER OPTICS EXPO – FOE 2015

Dates April 8 (Wed) - 10 (Fri) 2015
Location Tokyo Big Sight, Japan
Description
  • Mixing Waveguide of Multi-mode
  • Waveguide Substrate with Fiber Guide Trench & Technology
Official Web Site
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