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Events & Exhibition

Schedule

 

Past Events & Exhibition

JPCA Show 2019

Dates June 5th (Wed) - 7th (Fri) 2019
Location Tokyo Big Site, Japan
Description 1. West Hall 3
  • Base Materials Base Materials for Packages
  • Base Materialse for ICT Infrastructre / IoT Applicatuons
  • Base Materials for Automotive ADAS Applications
  • Photosensitive Materials Photosensitive Materials for Fine Partterning
  • Photosensitive Inslation Materials for Packages
  • Packaging Solution Center
2. West Hall Atrium / 3D MID Pavilion
  • Cu Paste for High Ampacity Circuit
NPI Presentation Next Generation Low Transmission Loss Multilayer Material MCL-LW-990G
Official Web Site

PCIM Europe 2019

Dates May 7th (Tue) - 9th (Thu), 2019
Location Exhibition Center Nuremberg, Germany
Description
  • High Heat Resistant Epoxy Molding Compound
  • High Heat Resistant Encapsulant for Case Module
  • Sintering Cu Paste
  • Low Elastic Modulus Sintering Paste
  • High Heat Resistant Insulating Coating Material
  • Thermal Interface Material
  • High Heat Resistance Injection Molding Case
  • Low Elastic Modulus Base Material
  • High Thermal Insulating Material
  • Soft Magnetic Core
Official Web Site

CAR-ELE JAPAN-11th Int'l Automotive Electronics Technology Expo in AUTOMOTIVE WORLD 2019

Dates Jan. 16 (Wed) – Jan. 18 (Fri), 2019
Venue & Booth No. Tokyo Big Sight
Description - Hitachi Chemical’s solutions for next generation vehicles -
  • Package materials for automobiles
    5G / AI / Millimeter wave radar / LiDAR / Camera module for sensor
  • Materials for electrification
    Power device / Motor / Battery materials
  • Thermal management materials
  • Connecting materials
  • Co-creation activities of Hitachi Chemical
    New packaging solution center in Shin-Kawasaki
Official Web Site

SEMICON Japan 2018

Dates Dec. 12 (Wed) – 14 (Fri), 2018
Venue & Booth No. Tokyo Big Sight, Japan
Description
  • Introduction of Package solution center
  • Materials for Semiconductor Packages
Official Web Site

2nd ADHESION & JOINING EXPO (inside Highly-fanctional Material Week)

Dates Dec. 5th(Wed) - 7th (Fri), 2018
Location Makuhari Messe, Japan
Products
  • Thin layer Strength Adhesive Material
  • Resin Metal Bonding Tecnology
  • Structural Adhesive
Official Web Site

JPCA Show 2018 (48th International Electronic Circuits Exhibition)

Dates June 6th (Wed) - 8th (Fri), 2018
Location Tokyo Big Sight, Japan
Description Base Materials
  • Base Materials for Packages
  • Base Materials for ICT Infrastructure / IoT Applications
  • Base Materials for Automotive /ADAS applications
Photosensitive Materials
  • Photosensitive Materials for Fine Patterning
  • Photosensitive Insulation Materials for Packages
Open Laboratory
NPI Presentation Low CTE, Low Modulus Prepreg for Next Generation PKG Applications "GEA-775G"
Official Web Site

American Coating Show

Dates April 10 (Tue) - 12 (Thu), 2018
Location Indiana Convention Center, Indianapolis, IN, USA
Description
  • Fanctional Acrylic Resins
  • UV-curable Materials
  • Epoxy Resin Hardeners
  • Heat Resistant Resin (Polyamide-imide)
Official Web Site

4th Advanced Digital Technology Expo in CONTENT TOKYO 2018

Dates Apr. 4 (Wed) – 6 (Fri)
Venue & Booth No. Tokyo Big Sight
Description
  • Light Integrator for AR Device
  • Light Integrator for Health Care
We will exhibit light integrator which realize the 1/2 of light mixing part volume compare to that of dichroic mirror method.
Official Web Site
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