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Events & Exhibition

Events & Exhibition

Schedule

Past Events & Exhibition

American Coating Show

Dates	April 10 (Tue) - 12 (Thu), 2018
Location	Indiana Convention Center, Indianapolis, IN, USA
Description	Fanctional Acrylic Resins UV-curable Materials Epoxy Resin Hardeners Heat Resistant Resin (Polyamide-imide)
Official Web Site	https://american-coatings-show.com/

4th Advanced Digital Technology Expo in CONTENT TOKYO 2018

Dates	Apr. 4 (Wed) – 6 (Fri)
Venue & Booth No.	Tokyo Big Sight
Description	Light Integrator for AR Device Light Integrator for Health Care We will exhibit light integrator which realize the 1/2 of light mixing part volume compare to that of dichroic mirror method.
Official Web Site	http://www.ct-next.jp/en/

GLOBE Forum 2018

Dates	2018 Mar 14 (Wed) - Mar 16 (Fri)
Venue & Booth No.	Vancouver Conference Centre, East Building, Vancouver, Canada
Description	Ceria based CO₂ adsorbent effective even under co-existence of water for CCS
Official Web Site	globeseries.com/forum

HVAC&R JAPAN 2018 HEATING, VENTILATING, AIR-CONDITIONING AND REFRIGERATING EXPO

Dates	Feb. 27 (Tue) - Mar. 2 (Fri), 2018
Location	Makuhari Messe, Japan
Description	Coatable Thermal Insulating Material Latent Thermal Storage Materials CO₂Adsorbent
Official Web Site	http://www.hvacr.jp/en/index.html

nano tech 2018 - The 17th International Nanotechnology Exhibition & Conference

Dates	Feb. 14 (Wed) - 16 (Fri.), 2018
Location	Tokyo Big Sight, Japan
Description	Stimuli-responsive Material Copper Clad Stretchable/Flexible Film Cu Paste for 3D-MID (Molded Interconnect Devices) Cu Bonding Paste that can be Sintered without Pressure Coatable Thermal Insulating Material Latant Thermal Storage Materials
Official Web Site	http://www.nanotechexpo.jp/index.html

CAR-ELE JAPAN-10th Int'l Automotive Electronics Technology Expo

Dates	Jan. 17th(Wed) - 19th (Fri), 2018
Location	Tokyo Big Sight, Japan
Products	High Thermal Resistant Epoxy Molding Compound High Thermal Resistant Encapsulant for Case Module Sintering Cu bonding paste Low Elastic Transient Liquid Phase Sintering Paste Resin Insulated Thick Copper Substrate for High Current Power Device High Heat Resistant Insulating Coating Materials Thermal Conductive Sheet Materials Containing Vertically
Official Web Site	http://www.automotiveworld.jp/en/About/CAR-ELE_JAPAN/

19th IC & Sensor Packaging Technology Expo in NEPCON JAPAN 2018

Dates	Jan. 17 (Wed) – Jan. 19 (Fri), 2018
Location	Tokyo Big Sight
Description	Photosensitive Insulation Film for Encapsulation and Embedding PX-1000 Low Transmission Loss Build-up Film AS-500HS Low Transmission Loss Build-up Film AS-400HS Low Transmission Loss / Low CTE Materials MCL-HS100 Encapsulation Material for High Frequency Devices CEL-X-DF series Stretchable Substrate Material
Official Web Site	http://www.nepconjapan.jp/en/About/ICP/

SEMICON Japan

Dates	December 13 (Wed) - 15 (Fri.), 2017
Location	Tokyo Big Sight, Tokyo, Japan
Description	Advanced Materials for Next-generation High Speed Communication Insulation Material for Wearable Device Conductive Materials for Automotive Electical Equipment Open Innovation Activity for Semiconductor Packages
Official Web Site	http://www.semiconjapan.org/en/

LED Japan 2017 (in All about Photonics)

Dates	October 4 (Wed.)-6 (Fri.), 2017
Location	Makuhari Messe
Description	Light mixing integrator This product can emit an uniform light by scattering and integration of LED or LD-RGB light source. Advantage 1: Compact design in the light mixing part. Advantage 2: Realization of high color uniformity. Advantage 3: Bright image with high light source utilization efficiency. Technical Contents: Combination of Mie scattering and enclosure of light.
Official Web Site	http://www.optojapan.jp/en/index.html

JPCA Show 2017 (47th International Electronic Circuits Exhibition)

Dates	June 7th (Wed) - 9th (Fri) 2017
Location	Tokyo Big Sight, Japan
Description	Open Laboratory Solution Introduction of Hitachi Chemical Open Laboratory Base Materials Base Materials for Packages and Modules Copper Clad Stretchable/Flexible Film Photosensitive Dry Film Photosensitive Materials for Fine Patterning Photosensitive Insulation Materials Equipment for PWB and PWB related Materials Laminator/Others
Official Web Site	http://www.jpcashow.com/show2017/en/

2nd CERAMICS JAPAN - Highly-functional Ceramics Expo

Dates	April 5(Wed.) - 7(Fri.), 2017
Location	Tokyo Big Sight, Japan
Products	High Thermal Conductive Insulating Adhesion Sheet for Power Devices Transient Liquid Phase Sintering Paste
Official Web Site	http://www.ceramics-japan.jp/en/

18th IC PACKAGING TECHNOLOGY EXPO

Dates	January 18 (Wed) - 20 (Fri), 2017
Location	Tokyo Big Sight, Tokyo, Japan
Description	Semiconductor Package Related Materials New Materials Materials for Wearable / Display / IoT Printed Wiring Boards
Official Web Site	http://www.nepconjapan.jp/en/About/ICP/

SEMICON Japan

Dates	December 14 (Wed) - 16 (Fri.), 2016
Location	Tokyo Big Sight, Tokyo, Japan
Description	Semiconductor Packaging Material Stretchable Insulating Material
Official Web Site	http://www.semiconjapan.org/en/

JPCA Show 2016(46th International Electronic Circuits Exhibition)

Dates	June 1st (Wed) - 3rd (Fri) 2016
Location	Tokyo Big Sight, Japan
Description	Base Materials Base Materials for ICT Infrastructure Base Materials for IoT/Smartphone PKG Module Base Materials for ASV Photosensitive Dry Film Process Materials Insulation Materials Equipment for PWB and PWB Rerated Materials Laminator / Others
NPI Presentation	New Low Transmission Loss & Low CTE Material "MCL-HS100" for Next Generation High Frequency Applications
Official Web Site	http://www.jpcashow.com/show2016/en/

1st CERAMICS JAPAN - Highly-functional Ceramics Expo

Dates	April 6 (Wed.) - 8 (Fri.), 2016
Location	Tokyo Big Sight, Japan
Products	High Thermal Conductive Insulating Adhesion Sheet for Power Devices Super Thick Copper PWB for High Current Power Devices Low Temperature Sintering, High Thermal Resistance after Sintering
Official Web Site	http://www.ceramics-japan.jp/en/

GLOBE 2016

Dates	March 2 (Wed.) - 4 (Fri.), 2016
Location	East Building of the Vancouver Convention Centre in Canada
Description	CO₂ Solid Adsorbent & Recovery Devices Inorganic Thermal Insulator Wavelength Conversion Particle Suspended Particle Device Films Lithium Ion Batteries for Industrial Use
Official Web Site	http://www.globeseries.com/

nano tech 2016 - The 15th International Nanotechnology Exhibition & Conference

Dates	January 27 (Wed.) - 29 (Fri.), 2016
Location	Tokyo Big Sight, JAPAN
Description	Porous Metal Copper Paste for Metal Bonding Inorganic-Organic Hybrid Porous Material Transparent Thermally Stable Polymer Transparent Tough Polymer Composite Particle Explanatory materials (PDF) < English Ver. > < Japanese Ver. >
Official Web Site	http://www.nanotechexpo.jp/index.html

17th IC PACKAGING TECHNOLOGY EXPO

Dates	January 13 (Wed.) - 15 (Fri.), 2016
Location	Tokyo Big Sight, JAPAN
Description	New Materials Materials for Semiconductor Packages Printed Wiring Boards Materials for PWB's Assembly Materials for PWBs
Official Web Site	http://www.icp-expo.jp/en/

CHINA COAT 2015

Dates	November 18 (Wed.) - 20 (Fri.) 2015
Location	Shanghai New International Expo Centre(SNIEC) Shanghai, China
Description	Functional (meth) acrylate Acrylic resins for coating UV-curable resins for coatings and display Polyurethane resins for gravure inks High heat resistant resin Over coating materials Tuffy series
Official Web Site	http://www.chinacoat.net/HTMLPagecc1260.htm

TPCA Show 2015 in Taiwan

Dates	October 21 (Wed.) - 23 (Fri.) 2015
Location	Taipei Nangang Exhibition Center, Taiwan
Description	MCL materials PGK application HDI application Network application Photec&Solder mask Capacitor Probe card
Official Web Site	http://www.tpcashow.com/en/

CommunicAsia2015

Dates	June 2 (Tue.) - 5 (Fri.)
Location	Marina Bay Sands, Singapore
Description	Energy Storage Devices
Official Web Site	http://www.communicasia.com/

JPCA Show 2015 (45th International Electronic Circuits Exhibition)

Dates	June 3rd (Wed) - 5th (Fri) 2015
Location	Tokyo Big Sight, Japan
Description	Base Materials Base materials for ICT interstructure equipment Base materials for semiconductor packages Base materials for automobile and smartphones Process Materials Photosensitive Materials Equipment for PWB and PWB Related Materials Laminator / Others
NPI Presentation	Ultra low CTE core material for APU(FC-CSP) application "MCL-E-770G" Material to reduce solder crack for automotive application "TD-002"
Official Web Site	http://www.jpcashow.com/show2015/en/

15th FIBER OPTICS EXPO – FOE 2015

Dates	April 8 (Wed) - 10 (Fri) 2015
Location	Tokyo Big Sight, Japan
Description	Mixing Waveguide of Multi-mode Waveguide Substrate with Fiber Guide Trench & Technology Explanatory materials (PDF) < English Ver. > < Japanese Ver. >
Official Web Site	http://www.foe.jp/en/Home/

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