12th IC PACKAGING TECHNOLOGY EXPO
We thank to all the visitors for having shared very significant opportunities with us.
Hitachi Chemical Booth at 12th IC PACKAGING TECHNOLOGY EXPO
Exhibited Products
- High-End Multilayer Material for various package substrates,"MCL-E-700G(R)series"
- Low CTE and Low Surface Roughness Halogen-Free Insulation Films,"AS-Z4"(Halogen-Free Insulation Film) /"SAPP" (Semi-Additive Process Primer)
- Photosensitive Solder Resist,"SR-7300G"
- Photosensitive Solder Resist Film,"FZ-2700Gseries"
- Epoxy Molding Compounds for semiconductor package "CEL" series
- Liquid Encapsulant for semiconductor package "CEL-C" series
- White Molding Compounds for LED package "CEL-W" series
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