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JPCA Show 2018 (48th International Electronic Circuits Exhibition)

We will introduce our latest PWB related advanced material technologies. It will be pleasure to welcome you to our booth.
We would appreciate you let us know any questions, comments or requests you may have.


Base Materials

  • Base Materials for Packages
  • Base Materials for ICT Infrastructure / IoT Applications
  • Base Materials for Automotive /ADAS applications

Photosensitive Materials

  • Photosensitive Materials for Fine Patterning
  • Photosensitive Insulation Materials for Packages

Open Laboratory

NPI Presentation

  • Low CTE, Low Modulus Prepreg for Next Generation PKG Applications "GEA-775G"
    Date: June 7th (Thu) 12:50 - 13:20 Location: Ⅱ room in East hall 7
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