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17th IC PACKAGING TECHNOLOGY EXPO

We thank to all the visitors for having shared very significant opportunities with us.

Products

New Materials

  • New Hybrid Resin "S.F.R"
  • Low Temperature Sintering Metal Paste
  • High Heat Dissipation Substrate

Materials for Semiconductor Packages

  • Thermal Conductive Die Attach Film
  • Embedding Insulation Sheet
  • Granule EMC for Compression Molding
  • Open Laboratory
  • Polyimide Coatings

Printed Wiring Boards

  • High Density & High Layer PWB
  • Ultra Thin Module PWB
  • Automotive PWB
  • Multi Wiring Board

Materials for PWB's Assembly

  • Transparent Conductive Transfer Film
  • Anisotropic Conductive Film
  • Stretchable Encapsulate for Wearable Devices
  • Low Temp. Curable Conductive Paste

Materials for PWBs

  • TD-002
  • AS-400HS
  • MCL-HS100
  • Photosensitive Dry Film
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