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Die Bonding Materials

This section offers explanations of key points necessary to understand Hitachi Chemical.

  • Origins of Hitachi Chemical
  • Key Business Fields
  • Hitachi Chemical by the Numbers
  • Major Products
  • Global Expansion

About Dicing Die Bonding Films

Among the die bonding materials supplied by Hitachi Chemical is its dicing die bonding films. These films are used during the process of manufacturing semiconductors for use in smartphones, tablet PCs, and other telecommunications devices. One of their main functions is connecting IC chips to substrates or connecting IC chips to each other. By firmly securing IC chips in place, these films help make semiconductors smaller and thinner.

Semiconductor Fabrication Process

Semiconductor Fabrication Process

Semiconductor Fabrication Process

Semiconductor Fabrication Process

Semiconductor Fabrication Process

Semiconductor Fabrication Process

Semiconductor Fabrication Process

Semiconductor Fabrication Process

Characteristics of Hitachi Chemical's Dicing Die Bonding Films

Hitachi Chemical's dicing die bonding films maintain superior levels of adhesion even under high temperature conditions, thereby contributing to the creation of more reliable semiconductor packages. This reliability has earned the Company a strong reputation, enabling it to capture the leading share for dicing die bonding films in the global market (based on the Company's estimates). Hitachi Chemical's films possess the functionality of both dicing tapes and die bonding films, and therefore enable manufacturers to simplify the process of attaching wafers to films, reducing the number of steps in the process from two to one.

Manufacturing Sites (Country & Region)

Manufacturing Sites (Country & Region)

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