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Copper-Clad Laminates

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About Copper-Clad Laminates

Copper-clad laminates are used in the electronic components of a wide range of electronic equipment, such as PCs and mobile terminals. Components made using copper-clad laminates include printed wiring boards and semiconductor packages.
The process of creating copper-clad laminates begins with glass cloth made from glass fiber. The glass cloth is impregnated with a varnish made primarily from epoxy or other resins, and is then coated in copper foil on both sides.

Copper-Clad Laminate Fabrication Process

Copper-Clad Laminate Fabrication Process

Copper-Clad Laminate Fabrication Process

Characteristics of Hitachi Chemical's Copper-Clad Laminates

Hitachi Chemical's copper-clad laminates feature improved reliability granted by superior heat resistance. In addition, their low thermal expansion coefficient and high elastic modulus reduce warping and flexure, thus enabling electronic equipment to realize higher performance and be made thinner. Further, they are made in an environmentally friendly manner and do not contain halogens.

Manufacturing Sites (Country & Region)

Manufacturing Sites (Country & Region)

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