Product Primer
Photosensitive Dry Films for Printed Wiring Boards
[Summary]
This is a film-type resist material that is applied to copper-clad laminates and used to form circuits when manufacturing printed wiring boards.
[Structure]
Composed of three layers:
a polyester base film, a photosensitive layer and a polyethylene cover film.
[Method of Use]
The method of manufacturing printed wiring board using photosensitive dry films is as follows:
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1) Peel off the cover film and apply to copper-clad laminate. |
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2) Place the photo mask on the base film and expose to ultraviolet rays. Photocure the sensitive layer of the photosensitive film in the exposed area. |
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3) Remove the photo mask and strip off the base film. |
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4) Develop the exposed photosensitive layer in a diluted alkaline solution, to remove the unexposed photosensitive area. The remaining cured photosensitive layer serves as the resist. |
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5) Use a copper chloride solution to dissolve and remove any copper that is not covered in the resist. |
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6) Remove the resist with a strong alkaline solution. The remaining copper underneath forms the circuit. |
[Market Share and Rank (company estimate)]
World share: Approximately 30%
Rank: No.1
[Manufacturing Bases]
- Coating and Slitting:
- Hitachi Chemical Co., Ltd., Yamazaki Work
- Hitachi Chemical (Johor) Sdn. Bhd.
- Hitachi Chemical (Dongguan) Co., Ltd.
- Slitting:
- Hitachi Chemical Co. (Hong Kong) Ltd.
- Hitachi Chemical Co. (Taiwan) Ltd.
- Hitachi Chemical Electronic Materials (Korea) Co., Ltd.
- Hitachi Chemical (Shanghai) Co., Ltd.
- Hitachi Chemical (Yantai) Co., Ltd.