Product Primer

Product Primer

Epoxy Molding Compounds for Semiconductor Encapsulation

[Summary]

Epoxy molding compounds are black plastic materials that encapsulate semiconductor chips to protect them from light, heat, humidity, dust, physical shock, etc. They are applied to almost all semiconductor packages.

[Materials]

Epoxy resin, filler, curing agent, etc.

[Method of Use]

The method of use in transfer molding, which is the most common method, is as follows:

	1) Set the lead frame connected to the semiconductor chip into the mold. 2) Set the molding compound tablet into the pot of the molding machine.
	3) Under mold temperature conditions of 170-180C°, melt the molding compound, and pour it into the mold under pressure.
	4) After applying pressure for 45-90 seconds, when the molding compound has been fully cured, open the mold and take out the molded parts. This completes encapsulation process.

[Features and Strengths of Hitachi Chemical's Products]

The strength of Hitachi Chemical's products lies in molding compounds best suited for memory devices, particularly DRAM and flash memory products. Miniaturization is most critical in memory devices among other semiconductors. Memory-use molding compounds must be capable of withstanding harsh conditions, as semiconductor chips must be protected from heat and moisture by the thinnest possible compound layer.

[Market Share and Rank (company estimate)]

World share: Over 20%
Rank: No.2

[Manufacturing Bases]

• Hitachi Chemical Co., Ltd., Shimodate Works
• Hitachi Chemical (Malaysia) Sdn. Bhd.
• Hitachi Chemical (Suzhou) Co., Ltd.