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Base Materials for PWBs

Glass Epoxy Multilayer Materials

Glass Epoxy Multilayer Material is superior in heat resistance and applicable to lead-free soldering process. We offer a wider selection of materials, such as standard FR-4, high heat resistance, high insulation resistance, and halogen-free materials.

Materials for ICT infrastructure

A wide range of material is available from the ones for semiconductor package with low CTE, high elastic modulus and halogen free properties to the ones for high-layer count PWB with high heat resistance property for lead-free soldering process.

Materials for Fine Patterning

Suitable for fine line patterning by semi-additive process.

Polyimide Multilayer Material

Polyimide Multilayer Material,MCL-I-671, is composed of glass modified Polyimide resin, low-temperature curing type material which can be processed as conventional FR-4. Prepreg's resin flow control technology enables from high to low flow.

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