Base Materials for PWBs
 - Glass epoxy Multilayer Material is superior in heat resistance and applicable to lead-free soldering process. We offer a wider selection of materials, such as standard FR-4, high heat resistance, high insulation resistance, and halogen-free materials.
 - A wide range of materials is available from the ones for semiconductor package with low CTE, high elastic modulus and halogen free properties to the ones for high-layer count PWB with high heat resistance property for lead-free soldering process.
 - Multilayer materials for high-frequency applications have dielectric property which corresponds higher frequency signal. Various types of materials are available, such as high heat resistance and halogen free, which are applicable to high frequency devices, antenna, wireless communication appliances and so on.
 - Thermal conductivity of MCL-E-510G is 1.0W/m·K, which is better than that of conventional FR-4 (0.3W/m·K).
As it contains glass cloth, it has good drilling process-ability, design-ability and lamination-ability as conventional FR-4.
 - Polyimide Multilayer Material,MCL-I-671, is applied denatured Polyimide resin and low-temperature curing type of material and can be processed as conventional FR-4. Prepreg's resin flow control technology enables from high to low flow.
 - Bendable. Low elasticity as 1/4 of conventional FR-4.
Not only the materials with glass cloth but film type are available and applicable to various type of PWB construction.
 - AS-Z3 is insulation film type of material for Semi-Additive-Process. It has low CTE, good insulation resistance properties, and enables enough peel strength with low surface roughness.
 - AS-2600/AS-2600W are adhesive films with good adhesion property. Both high reflectance of light type and no-flow type of materials are available.
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