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Electronics Related Products >> Base Materials for PWBs

High Tg Glass Epoxy Multilayer Material <MCL>

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These FR-5 equivalent materials offer increased Tg (175 TMA) and improved through-hole reliability. With minimal water absorption rates of less than 50% of conventional FR-4s, these materials use advanced resin technology to offer superior CAF restraining property and better wire bondability. It is suitable for the substrate of plastic BGA.

Features

  • High Tg & excellent through hole reliability
  • Superior moisture resistance and good insulation resistance
  • High heat resistance after water absorption
  • Good processability(for drilling punching)

Characteristics

Item Condition Unit Type No. MCL−E−679
Type No. MCL−E−-679B (R)
Type No. MCL−E−67(FR-4)
Tg TMA ºC 173~183 120~130
DMA ºC 205~215 150~160
Dielectric
constant
A (1MHz) C-96/20/65 4.6~4.8 4.7~4.8
A (1GHz)*1 C-96/20/65 4.2~4.6 4.2~4.3
Dissipation
factor
A (1MHz) C-96/20/65 0.0140~0.0150 0.0130~0.0170
A (1GHz)*1 C-96/20/65 0.0190~0.0260 0.0210~0.0250
Peel strength
(1/2 oz copper)
A kN/m 1.2~1.4 1.0~1.6
Water Absorption E-24/50+0-24/23 % 0.05~0.07 0.05~0.07
CAF 85 ºC/85RH%. 100V hrs >2000 >1000
Flammability (UL-94) A 94V-0 94V-0

Note) General properties measured by JIS C 6481.
*1Measured by triplate-line resonator.

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