These FR-5 equivalent materials offer increased Tg (175 TMA) and improved through-hole reliability. With minimal water absorption rates of less than 50% of conventional FR-4s, these materials use advanced resin technology to offer superior CAF restraining property and better wire bondability. It is suitable for the substrate of plastic BGA.

Features

• High Tg & excellent through hole reliability
• Superior moisture resistance and good insulation resistance
• High heat resistance after water absorption
• Good processability(for drilling punching)

Characteristics

Item		Condition	Unit	Type No. MCL−E−679 Type No. MCL−E−-679B (R)	Type No. MCL−E−67(FR-4)
Tg		TMA	ºC	173~183	120~130
		DMA	ºC	205~215	150~160
Dielectric constant	A (1MHz)	C-96/20/65	–	4.6~4.8	4.7~4.8
	A (1GHz)*1	C-96/20/65	–	4.2~4.6	4.2~4.3
Dissipation factor	A (1MHz)	C-96/20/65	–	0.0140~0.0150	0.0130~0.0170
	A (1GHz)*1	C-96/20/65	–	0.0190~0.0260	0.0210~0.0250
Peel strength (1/2 oz copper)		A	kN/m	1.2~1.4	1.0~1.6
Water Absorption		E-24/50+0-24/23	%	0.05~0.07	0.05~0.07
CAF		85 ºC/85RH%. 100V	hrs	>2000	>1000
Flammability (UL-94)		A	–	94V-0	94V-0

Note) General properties measured by JIS C 6481.
^*1Measured by triplate-line resonator.