These FR-5 equivalent materials offer increased Tg (175 TMA) and improved through-hole reliability. With minimal water absorption rates of less than 50% of conventional FR-4s, these materials use advanced resin technology to offer superior CAF restraining property and better wire bondability. It is suitable for the substrate of plastic BGA.
Features
High Tg & excellent through hole reliability
Superior moisture resistance and good insulation resistance
High heat resistance after water absorption
Good processability(for drilling punching)
Characteristics
Item
Condition
Unit
Type No. MCL−E−679
Type No. MCL−E−-679B (R)
Type No. MCL−E−67(FR-4)
Tg
TMA
ºC
173~183
120~130
DMA
ºC
205~215
150~160
Dielectric
constant
A (1MHz)
C-96/20/65
4.6~4.8
4.7~4.8
A (1GHz)*1
C-96/20/65
4.2~4.6
4.2~4.3
Dissipation
factor
A (1MHz)
C-96/20/65
0.0140~0.0150
0.0130~0.0170
A (1GHz)*1
C-96/20/65
0.0190~0.0260
0.0210~0.0250
Peel strength
(1/2 oz copper)
A
kN/m
1.2~1.4
1.0~1.6
Water Absorption
E-24/50+0-24/23
%
0.05~0.07
0.05~0.07
CAF
85 ºC/85RH%. 100V
hrs
>2000
>1000
Flammability (UL-94)
A
94V-0
94V-0
Note) General properties measured by JIS C 6481. *1Measured by triplate-line resonator.