MCL-E-73 has superior heat resistance property, which is suitable for the lead free soldering process with lower CTE and excellent through-hole reliability. It is well suited to electronics for automobiles, personal computer, high density electronic equipment etc...

Features

• Heat resistance is superior to that of our standard FR-4, and suitable for the lead free process.
• The coefficient of thermal expansion is lower than that of our standard FR-4 and that makes excellent through-hole reliability.
• Suitable for punching process.
• CAF restraining property is superior to that of our standard FR-4.

Characteristics

Items		Conditions	Units	Actual Values(t0.8mm)	Test Method(IPC TM-650)
Tg		TMA	°C	135～145	2.4.24
CTE ＊1	X	(30～120°C)	ppm/°C	12～15	2.4.24
	Y			14～17
	Z	(<Tg)		35～45
		(>Tg)		180～240
Copper Peel Strength	18μm	A	kN/m	1.2～1.4	2.4.8
Water Absorption		E-24/50+D-24/23	%	0.04～0.06	2.6.2.1
CAF		85°C/85%RH，100V	Hrs.	>1000	–
Decomposition Temperature(5% Weight Loss)		TGA	°C	340～360	2.3.40

*1) : Heating Rate: 10°C/min.