Electronics Related Products >> Base Materials for PWBs
High Heat Resistance Multilayer Material (FR-4)
MCL-E-73 · GEA-73N <prepreg>Inquiry
- MCL-E-73 has superior heat resistance property, which is suitable for the lead free soldering process with lower CTE and excellent through-hole reliability. It is well suited to electronics for automobiles, personal computer, high density electronic equipment etc...
Features
- Heat resistance is superior to that of our standard FR-4, and suitable for the lead free process.
- The coefficient of thermal expansion is lower than that of our standard FR-4 and that makes excellent through-hole reliability.
- Suitable for punching process.
- CAF restraining property is superior to that of our standard FR-4.
Characteristics
| Items | Conditions | Units | Actual Values(t0.8mm) | Test Method(IPC TM-650) | |
|---|---|---|---|---|---|
| Tg | TMA | °C | 135～145 | 2.4.24 | |
| CTE ＊1 | X | (30～120°C) | ppm/°C | 12～15 | 2.4.24 |
| Y | 14～17 | ||||
| Z | (<Tg) | 35～45 | |||
| (>Tg) | 180～240 | ||||
| Copper Peel Strength | 18μm | A | kN/m | 1.2～1.4 | 2.4.8 |
| Water Absorption | E-24/50+D-24/23 | % | 0.04～0.06 | 2.6.2.1 | |
| CAF | 85°C/85%RH，100V | Hrs. | >1000 | – | |
| Decomposition Temperature(5% Weight Loss) | TGA | °C | 340～360 | 2.3.40 | |
*1) : Heating Rate: 10°C/min.
