"Type No. MCL-E-679F is high elastic modulus and low CTE materials. (20% lower of CTE compared to conventional FR-4.) And it has the properties for higher elasticity, higher barcol hardness.
The warpage is very low, and it is suitable for the substrates of plastic BGA, memory card, memory module boards, base core material for build-up PWB, and LCD's driver boards."

Features

• The coefficient of thermal expansion is about 20% (in the X and Y-directions) and about 50% (in the Z-direction) lower than that of our standard FR-4.
• Elastic modulus is about 30% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection.
• Superior heat resistance at PCT.
• The surface roughness is about 1/4 that of our standard FR-4, making fine pattern possible.

Applications

• Semiconductor packages. (FC-BGA, BGA, CSP)
• Core material for HDI.

Characteristics

Thin Laminate

Items		Conditions	Units	Actual Values (t0.8mm)	Test Method (IPC TM-650)
				MCL-E-679F(R)
Dielectric Constant	1MHz	C-96/20/65	—	4.8～5.0	2.5.5.1
Dissipation Factor	1MHz	C-96/20/65	—	0.0080～0.0100	2.5.5.1
Tg		TMA	°C	160～170	2.4.24
Flexural Modulus (Lengthwise)		A	GPa	27～33	2.4.4
CTE *1	X	(30～120°C)	ppm/°C	12～14	2.4.24
	Y			12～14
	Z	(<Tg)		20～30
		(>Tg)		130～160
Copper Peel Strength	18μm	A	kN/m	1.1～1.2	2.4.8
Water Absorption		E-24/50+D-24/23	%	0.03～0.05	2.6.2.1

• *1) : Heating Rate:10°C/min.

Prepreg

Type			Glass Cloth			Properties
			Style	Weight (g/m2)	Yarn Count (warp×fill)	Resin Content (%)	Volatile Content (%)	Gelation Time (sec.)	Dielectric Thickness after Lamination *1 (mm)
R Type	0.04	FRZPE	1037	24	69×72	73±2	<1.0	115±25	0.048
	0.06	FRROE	1078	48	53×53	68±2		110±25	0.078
	0.1	FRSKE	2116	104	60×58	58±2	<0.75		0.125

• *1) : The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 5%.
  This value changes according to the press condition and inner-layer pattern.