Halogen Free, High Elastic Modulus
and Low CTE Multilayer Material <MCL>

MCL-E-679FG(R) · FG(S), MCL-E-679FGB(S)<Black Type>
· GEA-679FG(R) · FG(S) <prepreg>Product Inquiry
Image of <MCL>
"Type no. MCL-E-679FG" has achieved the UL94V-0 level of flammability without using any compound which includes halogen, antimony or red phosphorous.This material has high-Tg, high elastic modulus and low CTE. So it is suitable for the substrates of plastic package, LCD's driver boards, and high density interconnection and advantageous for the soldering process at high temperature with lead free solder.

Features

  • Halogen free material for environmental concerns.
  • CTE (Z-direction) is about 50% lower than that of our standard FR-4.
  • Elastic modulus is about 20% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection.
  • Superior heat resistance for soldering.(Suitable for the lead free process)
  • Surface roughness is about 1/4 of our standard FR-4, and making fine pattern possible.

Characteristics

Thin Laminate

(t0.8m)
Items Conditions Units FR-4 Test Method
(IPC TM-650)
MCL-E-679FG(R) MCL-E-679FG(S)
Tg TMA °C 163～173 175～185 2.4.24
CTE *1 X (30～120°C) ppm/°C 13～15 12～14 2.4.24
Y 13～15 12～14
Z (<Tg) 23～33 20～30
(>Tg) 140～170 130～160
Copper Peel Strength 18μm A kN/m 0.9～1.1 1.1～1.2 2.4.8
Dielectric Constant 1MHz C-96/20/65 — 5.2～5.4 5.0～5.2 2.5.5.1
Dissipation Factor 1MHz C-96/20/65 — 0.0080～0.0100 2.5.5.1
Water Absorption E-24/50+D-24/23 % 0.04～0.06 0.03～0.05 2.6.2.1
  • *1) : Heating Rate:10°C/min.

Prepreg

Type Glass Cloth Properties
Style Weight
(g/m2)		 Yarn Count
(warp×fill)		 Resin Content
(%)		 Volatile Content
(%)		 Gelation Time
(sec.)		 Dielectric Thickness
after Lamination *1 (mm)
R Type 0.04 GRZPE 1037 24 69×72 73±2 <1.0 170±30 0.048
0.06 GRROE 1078 48 53×53 68±2 160±30 0.078
0.1 GRSKE 2116 104 60×58 58±2 <0.75 0.125
S Type 0.04 GSZPE 1037 24 69×72 73±2 <1.0 170±30 0.048
0.06 GSROE 1078 48 53×53 68±2 160±30 0.078
0.1 GSSKE 2116 104 60×58 58±2 <0.75 0.125
Test Method (IPC TM-650)   2.3.16.1 2.3.19 2.3.18 –
  • *1) : The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 5%.
    This value changes according to the press condition and inner-layer pattern.
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