Electronics Related Products >> Base
Materials for PWBs
Halogen Free, High Elastic
Modulus
and Low CTE Multilayer Material <MCL>
MCL-E-679FG(R) · FG(S),
MCL-E-679FGB(S)<Black Type>
· GEA-679FG(R) · FG(S) <prepreg>Inquiry
· GEA-679FG(R) · FG(S) <prepreg>Inquiry
- "Type no. MCL-E-679FG" has achieved the UL94V-0 level of flammability without using any compound which includes halogen, antimony or red phosphorous.This material has high-Tg, high elastic modulus and low CTE. So it is suitable for the substrates of plastic package, LCD's driver boards, and high density interconnection and advantageous for the soldering process at high temperature with lead free solder.
Features
- Halogen free material for environmental concerns.
- CTE (Z-direction) is about 50% lower than that of our standard FR-4.
- Elastic modulus is about 20% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection.
- Superior heat resistance for soldering.(Suitable for the lead free process)
- Surface roughness is about 1/4 of our standard FR-4, and making fine pattern possible.
Characteristics
Thin Laminate
| Items | Conditions | Units | FR-4 | Test Method (IPC TM-650) |
||
|---|---|---|---|---|---|---|
| MCL-E-679FG(R) | MCL-E-679FG(S) | |||||
| Tg | TMA | °C | 163～173 | 175～185 | 2.4.24 | |
| CTE *1 | X | (30～120°C) | ppm/°C | 13～15 | 12～14 | 2.4.24 |
| Y | 13～15 | 12～14 | ||||
| Z | (<Tg) | 23～33 | 20～30 | |||
| (>Tg) | 140～170 | 130～160 | ||||
| Copper Peel Strength | 18μm | A | kN/m | 0.9～1.1 | 1.1～1.2 | 2.4.8 |
| Dielectric Constant | 1MHz | C-96/20/65 | — | 5.2～5.4 | 5.0～5.2 | 2.5.5.1 |
| Dissipation Factor | 1MHz | C-96/20/65 | — | 0.0080～0.0100 | 2.5.5.1 | |
| Water Absorption | E-24/50+D-24/23 | % | 0.04～0.06 | 0.03～0.05 | 2.6.2.1 | |
- *1) : Heating Rate:10°C/min.
Prepreg
| Type | Glass Cloth | Properties | |||||||
|---|---|---|---|---|---|---|---|---|---|
| Style | Weight (g/m2) |
Yarn Count (warp×fill) |
Resin Content (%) |
Volatile Content (%) |
Gelation Time (sec.) |
Dielectric Thickness after Lamination *1 (mm) |
|||
| R Type | 0.04 | GRZPE | 1037 | 24 | 69×72 | 73±2 | <1.0 | 170±30 | 0.048 |
| 0.06 | GRROE | 1078 | 48 | 53×53 | 68±2 | 160±30 | 0.078 | ||
| 0.1 | GRSKE | 2116 | 104 | 60×58 | 58±2 | <0.75 | 0.125 | ||
| S Type | 0.04 | GSZPE | 1037 | 24 | 69×72 | 73±2 | <1.0 | 170±30 | 0.048 |
| 0.06 | GSROE | 1078 | 48 | 53×53 | 68±2 | 160±30 | 0.078 | ||
| 0.1 | GSSKE | 2116 | 104 | 60×58 | 58±2 | <0.75 | 0.125 | ||
| Test Method (IPC TM-650) | 2.3.16.1 | 2.3.19 | 2.3.18 | – | |||||
- *1) : The dielectric thickness after lamination
is defined as the thickness of one sheet of prepreg
when the resin flow is within 5%.
This value changes according to the press condition and inner-layer pattern.
