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Materials for PWBs
High Elastic Modulus, Low CTE Multilayer Materials
for Thin Package Substrates <MCL>
MCL-E-679GT · GEA-679GT <prepreg>Inquiry
- MCL-E679GT has halogen free, lower CTE and higher modulus, which is suitable for thin package as SiP and PoP application.
Features
- MCL-E-679GT is effective for reducing warpage of thin PKG because of lower CTE (before and after Tg) and higher modulus.
- By superior electrical properties, It is possible to reduce transmission loss.
- Using copper profile, it is possible to make fine line by semiadditive process.
- MCL-E-679GT has good drill processability and CAF restraining property to be adaptable for high density PKG.
Characteristics
Thin Laminate
| Items | Conditions | Units | Actual Values (t0.8mm) | Test Method (IPC TM-650) |
|
|---|---|---|---|---|---|
| Tg | TMA | °C | 165～175 | 2.4.24 | |
| CTE*1 | X | (30～120°C) | ppm/°C | 11～13 | 2.4.24 |
| Y | 11～13 | ||||
| Z | (< Tg) | 20～30 | |||
| (> Tg) | 110～140 | ||||
| Copper Peel Strength | 18μm | A | kN/m | 1.0～1.2 | 2.4.8 |
| Water Absorption | E-24/50+D-24/23 | % | 0.04～0.06 | 2.6.2.1 | |
| Flexural Modulus (Lengthwise) | A | GPa | 28～33 | 2.4.4 | |
| Surface Resistance | A | μm | 2～3 | 2.2.17 | |
| Decomposition Temperature | TGA | °C | 340～360 | 2.3.40 | |
- *1) : Heating Rate:10°C/min.
