Low Dissipation Factor,
High Heat Resistance Multilayer Material <MCL>

Image of <MCL>
"Type No. MCL-LX-67Y" is high heat resistance multilayer material, which indicates low dielectric constant and low dissipation factor in GHz range of frequency, and also the processing characteristics are close to conventional FR-4. It is suitable for high frequency circuit board of cellular phone base station in the wireless communication market.

Features

  • Low transmission loss in GHz range of frequency (about 40% of FR-4)
  • Drift of its dielectric properties is small.
    (frequency dependence, temperature dependence, after water absorption)
  • High Tg, low water absorption, high heat resistance

Characteristics

Item Condition Unit Type No.
MCL-LX-67Y
Type No.
MCL-E-67 (FR-4)
Dielectric constant 1MHz C-96/20/65 3.5~3.7 4.7~4.8
1GHz*1 C-96/20/65 3.4~3.6 4.2~4.3
Dissipation factor 1MHz C-96/20/65 0.0025~0.0045 0.0130~0.0170
1GHz*1 C-96/20/65 0.0045~0.0065 0.0210~0.0250
Peel strength (18μm) A kN/m 1.0~1.4 1.4~1.6
Tg TMA ºC 185~195 120~130
Solder heat resistance
(20s/260 ºC)
A OK OK
PCT-4hrs OK OK
Water absorption E-24/50+D-24/23 % 0.03~0.04 0.05~0.07
CAF 85 ºC/85RH%, 100V hrs >1000 >1000
Flammability (UL-94) A 94V-0 94V-0

Note) General properties measured by JIS C 6481.
*1 : Measured by triplate-line resonator

ending of main content