Electronics Related Products >> Base Materials
for PWBs
Halogen Free, Low Dielectric Constant,
Low Dissipation Factor Multilayer Material <MCL>
MCL-LZ-71G · GZA-71G <prepreg>Inquiry
- MCL-LZ-71G is halogen free and has high heat resistance property for the lead-free soldering process, suitable for high-frequency application, network applications, base station, high speed modules, with its low transmission loss property.
Features
- Transmission loss in the GHz band can be reduced to about 40% of our standard FR-4.
- Halogen free material for environmental concerns.
- General-purpose glass fabric (E-glass) specification makes drilling and cutting workability as high as that of our standard FR-4.
- High Tg, low water absorption and excellent heat resistance.
Characteristics
Thin Laminate
| Items | Conditions | Units | Actual Values (t0.8mm) | Test Method (IPC TM-650) | |
|---|---|---|---|---|---|
| Dielectric Constant | 1MHz | C-96/20/65 | — | 3.60～3.80 | 2.5.5.1 |
| 1GHz*1 | 3.50～3.70 | 2.5.5.5 | |||
| 3.55～3.75 | 2.5.5.9 | ||||
| 1GHz*2 | |||||
| Dissipation Factor | 1MHz | C-96/20/65 | — | 0.0030～0.0050 | 2.5.5.1 |
| 1GHz*1 | 0.0050～0.0070 | 2.5.5.5 | |||
| 1GHz*2 | 0.0035～0.0055 | 2.5.5.9 | |||
| Copper Peel Strength | 18μm (Low Profile) | A | kN/m | 0.6～1.0 | 2.4.8 |
| Tg | TMA | °C | 165～175 | 2.4.24 | |
| Solder Heat Resistance (260°C) | A | Sec. | >300 | – | |
| Water Absorption | E-24/50+D-24/23 | % | 0.03～0.04 | 2.6.2.1 | |
| CAF | 85°C/85% RH,100V | Hrs. | >1000 | – | |
| Flammability (UL-94) | A | — | V–0 Equivalent | 2.3.10 | |
| Decomposition Temperature (5% Weight Loss) | TGA | °C | 350～370 | 2.3.40 | |
- *1) : Measured by Triplate-line Resonator.
- *2) : Measured by Material Analyzer.
