Low Dielectric Constant, Low Dissipation Factor,
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Items | Conditions | Units | Actual Values (t0.8mm) | Test Method (IPC TM-650) | |
|---|---|---|---|---|---|
| Dielectric Constant | 1MHz | C-96/20/65 | — | 3.50~3.70 | 2.5.5.1 |
| 1GHz*1 | 3.30~3.50 | 2.5.5.5 | |||
| 1GHz*2 | 3.50~3.70 | 2.5.5.9 | |||
| Dissipation Factor | 1MHz | C-96/20/65 | — | 0.0005~0.0010 | 2.5.5.1 |
| 1GHz*1 | 0.0020~0.0030 | 2.5.5.5 | |||
| 1GHz*2 | 0.0010~0.0020 | 2.5.5.9 | |||
| Copper Peel Strength | 18μm (Low Profile) | A | kN/m | 0.4~0.7 | 2.4.8 |
| Tg | TMA | °C | 175~185 | 2.4.24 | |
| Solder Heat Resistance (260°C) | A | Sec. | >300 | – | |
| Water Absorption | E-24/50+D-24/23 | % | 0.03~0.04 | 2.6.2.1 | |
| CAF | 85°C/85% RH, 100V | Hrs. | >1000 | – | |
| Flammability (UL-94) | A | — | V–0 Equivalent | 2.3.10 | |
| Decomposition Temperature (5% Weight Loss) | TGA | °C | 350~370 | 2.3.40 | |
- *1) : Measured by Triplate-line Resonator.
- *2) : Measured by Material Analyzer.
