Electronics Related Products >> Base Materials
for PWBs
Halogen Free, Low Dielectric Constant,
High Heat Resistance Multilayer Material <MCL>
MCL-HE-679G · GHA-679G <prepreg>Inquiry
- MCL-HE-679G is halogen free and has good dielectric characteristic suitable for high frequency signals, and superior heat resistance for high layer count board. lt is suitable for network applications (router, server), and high frequency devices.
Features
- Dissipation factor is about 50% lower than that of our standard FR-4.
- High Tg and superior heat resistance for soldering. (Suitable for the lead free process)
- The coefficient of thermal expansion in Z-direction is about 30% lower than that of our standard FR-4.
- Environmentally friendly material. It achieved the UL 94-V-O level of flammability without using any compound which includes halogen, antimony or red phosphorous.
Characteristics
Thin Laminate
| Items | Conditions | Units | Actual Values (t0.8mm) | Test Method (IPC TM-650) | |
|---|---|---|---|---|---|
| Dielectric Constant | 1MHz | C-96/20/65 | — | 4.30～4.50 | 2.5.5.1 |
| 1GHz*1 | 3.90～4.10 | 2.5.5.5 | |||
| 1GHz*2 | 4.10～4.30 | 2.5.5.9 | |||
| Dissipation Factor | 1MHz | C-96/20/65 | — | 0.0060～0.0080 | 2.5.5.1 |
| 1GHz*1 | 0.0080～0.0100 | 2.5.5.5 | |||
| 1GHz*2 | 0.0070～0.0090 | 2.5.5.9 | |||
| Copper Peel Strength | 18μm | A | kN/m | 0.8～1.1 | 2.4.8 |
| Tg | TMA | °C | 180～190 | 2.4.24 | |
| Solder Heat Resistance (260°C) | A | Sec. | >300 | – | |
| Water Absorption | E-24/50+D-24/23 | % | 0.03～0.04 | 2.6.2.1 | |
| CAF | 85°C/85% RH, 100V | Hrs. | >1000 | – | |
| Flammability (UL-94) | A | — | V–0 Equivalent | 2.3.10 | |
| Decomposition Temperature (5% Weight Loss) | TGA | °C | 370～390 | 2.3.40 | |
- *1) : Measured by Triplate-line Resonator.
- *2) : Measured by Material Analyzer.
