Electronics Related Products >> Base Materials for PWBs
Low Press Temperature, Adhesive Film
AS−2600Inquiry
- "Type No. AS-2600" can be laminated under low press temperature and low press conditions. It is suitable for lamination to polyimide film and other metal (ex. nickel).
Characteristics
| Item | Unit | Type No. AS-2600 | |
|---|---|---|---|
| Thickness | μm | 25, 50 | |
| Elasticity | MPa | 500 | |
| Volume resistivity | Ω ∙ cm | 1E 14 | |
| Dielectric constant | – | 3.8 | |
| Copper peel strength | mat side | KN/m | 1.6 |
| shiny side | 1.2 | ||
| Polyimide peel strength | 1.1 | ||
| Process condition | press temperature | ºC | 120 |
| pressure | MPa | 0.2 | |
| after cure | – | 150 ºC/1hr | |
| flow out length | μm | 300 | |
Note) General properties measured by JIS C 6481.