Low Press Temperature, Adhesive Film

Image of Low Press Temperature, Adhesive Film
"Type No. AS-2600" can be laminated under low press temperature and low press conditions. It is suitable for lamination to polyimide film and other metal (ex. nickel).

Characteristics

Item Unit Type No. AS-2600
Thickness μm 25, 50
Elasticity MPa 500
Volume resistivity Ω ∙ cm 1E 14
Dielectric constant 3.8
Copper peel strength mat side KN/m 1.6
shiny side 1.2
Polyimide peel strength 1.1
Process condition press temperature ºC 120
pressure MPa 0.2
after cure 150 ºC/1hr
flow out length μm 300

Note) General properties measured by JIS C 6481.

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