Glass Epoxy Multilayer Material
 - MCL-BE-67G Series, Halogen Free Multilayer Material has achieved the UL94V-0 level of flammability. This material has good heat resistance and high elastic modulus at high temperature, and it is suitable for high density interconnection technology.
Features
- MCL-BE-67G series is environmentally friendly which achieves flammability UL94V-0 without using halogen, antimony and red phosphorus.
It also has higher Tg and stable dielectric properties.
- MCL-BE-67G Type(S) has upgraded flammability and is better tolerant of higher temperature lead-free soldering process.
- MCL-BE-67G type(H) is standard halogen free FR-4 material.
Characteristics
t0.8mm
| Item |
Condition |
Unit |
MCL-BE-67G Type(S) |
MCL-BE-67G Type(H) |
Standard FR-4 |
| Tg |
TMA |
°C |
135~145 |
140~150 |
120~130 |
| DMA |
160~200 |
180~220 |
150~160 |
| T260(With copper) |
TMA |
min. |
>20 |
10~20 |
10~20 |
| Solder float(288°C) |
A |
sec. |
>300 |
>120 |
<120 |
| CTE |
Z |
<Tg |
ppm/°C |
30~45 |
40~55 |
50~70 |
| >Tg |
150~230 |
170~250 |
240~310 |
| Flexural modulus |
A |
GPa |
23~26 |
23~26 |
22~25 |
| Water absorption |
PCT 3hr |
% |
0.6~0.7 |
0.6~0.7 |
1.1~1.2 |
| Dielectric constant |
1MHz |
C-96/20/65 |
– |
4.9~5.1 |
4.8~5.0 |
4.6~4.8 |
| 1GHz |
4.4~4.6 |
4.3~4.5 |
4.0~4.2 |
| Dissipation factor |
1MHz |
C-96/20/65 |
– |
0.006~0.007 |
0.006~0.007 |
0.015~0.017 |
| 1GHz |
0.009~0.011 |
0.009~0.011 |
0.018~0.020 |
- PCT: Pressure Cooker Test (121°C 0.22MPa)
Dk,Df at 1GHz: Triplate-line Resonator
Applications
- Middle-high layer PWB for servers, routers, network applications,High reliable PWB for automobiles.
- High density digital electronic equipment, etc.
Catalogues / Technical Data
- MCL-BE-67G SeriesPDF(367KB)
Link for Other Glass Epoxy Multilayer Material
- MCL-E-67Details
- MCL-E-73Details
- MCL-E-75GDetails
Link for Glass Epoxy Multilayer Material Characteristics
Characteristics
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