Glass Epoxy Multilayer Material

Item Condition Unit MCL-E-67 MCL-E-73 MCL-BE-67G Series
*Type(S)
MCL-E-75G
Tg TMA °C 120~130 135~145 135~145 160~170
DMA 150~160 170~180 205~215
CTE X 30~120°C ppm/°C 13~16 12~15 13~16 12~14
Y 14~17 14~17 16~19 14~16
Z <Tg 50~70 35~45 30~45 30~40
>Tg 200~300 180~240 150~230 180~240
Copper peal strength 18μm A kN/m 1.4~1.6 1.2~1.4 1.2~1.4 1.3~1.5
35μm 1.7~2.1 1.6~1.8 1.3~1.5 1.5~1.8
Solder heat resistance 260°C A sec. >120 >300 >300 >600
Dielectric constant 1MHz C-96/20/65 4.7~4.8 4.9~5.1 4.9~5.1 5.0~5.2
1GHz 4.1~4.2 4.2~4.4 4.4~4.6 4.4~4.6
Dissipation factor 1MHz C-96/20/65 0.0130
~0.0170
0.0140
~0.0160
0.0060
~0.0070
0.0090
~0.0110
1GHz 0.0180
~0.0200
0.0180
~0.0200
0.0090
~0.0110
0.0140
~0.0160
Key word FR-4 Superior heat resistance High Tg, Halogen-free High Tg, Halogen-free
Superior heat resistance
 

Link for Glass Epoxy Multilayer Material

MCL-E-67Details
MCL-E-73Details
MCL-BE-67G SeriesDetails
MCL-E-75GDetails
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