High Tg Glass Epoxy Multilayer Material
 - MCL-E-700G Type (R) is halogen free, high Tg, high elastic modulus, and low CTE multilayer material.
It is suitable for package substrates with Build-Up construction.
Features
- MCL-E-700G Type(R) has very low CTE in X, Y direction and reduce warpage of package substrate significantly.
- Well-suited for build-up construction.
- Good drill processability ; lower process cost.
- Halogen-free, UL94V-0 achieved, without using any compound which includes halogen, antimony or red phosphorus.
Characteristics
| Item |
Condition |
Unit |
MCL-E-700G
Type(R) |
MCL-E-700G
Type(RL) |
MCL-E-679FG
Type(R) |
| Tg |
TMA |
°C |
220~240 |
220~240 |
165~175 |
| CTE |
X,Y |
α1 |
ppm
/°C |
7~9 |
5~7 |
13~15 |
| α2 |
5~7 |
5~7 |
10~12 |
| Z |
α1 |
15~25 |
15~25 |
23~33 |
| α2 |
90~120 |
90~120 |
140~170 |
| Heat resistance(PCT) |
288°C
/solder/20s |
h |
>4 |
>4 |
4 |
Heat resistance with insulation
film for Semi-Additive Process |
260 °C reflow |
cycle |
>20 |
>20 |
>10 |
| Flexural modulus |
A |
GPa |
32~34 |
34~36 |
23~28 |
| Thermal Conductivity |
Xe-Flash
method |
W/m·K |
0.79~0.83 |
0.79~0.83 |
0.79~0.83 |
Viscoelastic data
Warpage Analysis
Applications
- Semiconductor Package Substrate, Core materials for HDI etc.
Catalogues / Technical Data
- MCL-E-700G Type(R)PDF(398KB)
Link for Other High Tg Glass Epoxy Multilayer Material
- MCL-E-679 Type(W)Details
- MCL-E-679F Type(J)Details
- MCL-E-679F Type(R)Details
- MCL-E-679FG SeriesDetails
- MCL-E-679GTDetails
Link for High Tg Glass Epoxy Multilayer Material Characteristics
Characteristics
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