Item		Condition	Unit	MCL-E-679 Type(W)	MCL-E-679F Type(J)	MCL-E-679F Type(R)	MCL-E-679FG Type(S)
Tg		TMA	°C	173~183	170~175	160~170	175~185
		DMA		205~215	195~205	190~200	210~330
CTE	X	30~120°C	ppm/°C	12~15	12~15	12~14	12~14
	Y			14~17	14~17	12~14	12~14
	Z	<Tg		50~60	35~45	20~30	20~30
		>Tg		200~300	180~240	130~160	130~160
Copper peel strength	18μm	A	kN/m	1.2~1.4	1.1~1.4	1.1~1.2	1.1~1.2
	35μm			1.5~1.7	1.4~1.6	1.2~1.3	1.2~1.3
Solder heat resistance 260°C		A	sec.	>300	>300	>300	>300
Flexural modulus(Lengthwise)		A	GPa	24~26	25~31	27~33	24~29
Dielectric constant	1MHz	C-96/20/65	–	4.7~4.8	4.6~4.8	4.8~5.0	5.0~5.2
	1GHz			4.2~4.3	4.2~4.4	4.5~4.7	4.7~4.9
Dissipation factor	1MHz	C-96/20/65	–	0.0130 ~0.0150	0.0110 ~0.0130	0.0080 ~0.0100	0.0080 ~0.0100
	1GHz			0.0210 ~0.0220	0.0170 ~0.0190	0.0130 ~0.0150	0.0140 ~0.0160
Key word				High Tg	High Tg, Superior heat resistance	High Tg, Low CTE	Halogen-free, High Elastic, Low CTE

Item		Condition	Unit	MCL-E-679GT	MCL-E-700G Type(R)	MCL-E-700G Type(RL)
Tg		TMA	°C	165~175	220~240	220~240
		DMA		200~220	240~270	240~270
CTE	X	30~120°C	ppm/°C	11~13	7~9	5~7
	Y			11~13	7~9	5~7
	Z	<Tg		20~30	15~25	15~25
		>Tg		110~140	90~120	90~120
Copper peel strength	18μm	A	kN/m	1.0~1.2	0.9~1.1	0.9~1.1
	35μm			1.1~1.3	1.0~1.2	1.0~1.2
Solder heat resistance 260°C		A	sec.	>300	>300	>300
Flexural modulus(Lengthwise)		A	GPa	24~29	32~34	34~36
Dielectric constant	1MHz	C-96/20/65	–	4.8~5.0	4.8~5.0	4.5~4.7
	1GHz			4.6~4.8	4.5~4.7	4.2~4.4
Dissipation factor	1MHz	C-96/20/65	–	0.0050~0.0070	0.0070~0.0090	0.0080~0.0100
	1GHz			0.0120~0.0140	0.0090~0.0110	0.0100~0.0120
Key word				Halogen-free, High Elastic, Low CTE	Halogen-free, High Elastic, Low CTE	Halogen-free, High Elastic, Low CTE

Link for High Tg Glass Epoxy Multilayer Material

MCL-E-679 Type(W)Details

MCL-E-679F Type(J)Details

MCL-E-679F Type(R)Details

MCL-E-679FG SeriesDetails

MCL-E-679GTDetails

MCL-E-700G Type(R)Details