Materials for High Frequency Application
| Item |
Condition |
Unit |
MCL-LX-67Y |
MCL-LX-67F |
MCL-LZ-71G |
MCL-HE-679G |
| Tg |
TMA |
°C |
185~195 |
165~175 |
165~175 |
180~190 |
| DMA |
225~245 |
190~200 |
210~220 |
210~220 |
| CTE |
X |
30~120°C |
ppm/°C |
15~18 |
14~15 |
15~18 |
12~15 |
| Y |
15~18 |
14~15 |
15~18 |
14~17 |
| Z |
<Tg |
50~60 |
14~15 |
40~50 |
35~45 |
| >Tg |
300~370 |
70~100 |
280~310 |
190~220 |
| Copper peel strength |
18μm |
A |
kN/m |
0.8~1.2(Low Profile) |
0.6~1.0(Low Profile) |
0.6~1.0(Low Profile) |
0.8~1.1 |
| 35μm |
1.0~1.4(LP Profile) |
0.8~1.2(LP Profile) |
0.7~1.1(LP Profile) |
0.9~1.2 |
| Solder heat resistance 260°C |
A |
sec. |
>300 |
>300 |
>300 |
>300 |
| Dielectric constant |
1MHz |
C-96/20/65 |
– |
3.50~3.70 |
3.70~3.90 |
3.60~3.80 |
4.30~4.50 |
| 1GHz*1 |
3.40~3.60 |
3.60~3.80 |
3.50~3.70 |
3.90~4.10 |
| 1GHz*2 |
3.45~3.65 |
3.70~3.90 |
3.55~3.75 |
4.10~4.30 |
| Dissipation factor |
1MHz |
C-96/20/65 |
– |
0.0025
~0.0045 |
0.0010
~0.0020 |
0.0030
~0.0050 |
0.0060
~0.0080 |
| 1GHz*1 |
0.0045
~0.0065 |
0.0030
~0.0040 |
0.0050
~0.0070 |
0.0080
~0.0100 |
| 1GHz*2 |
0.0030
~0.0050 |
0.0020
~0.0030 |
0.0035
~0.0055 |
0.0070
~0.0090 |
| Key word |
Low Dk, Df |
Low Dissipation Factor |
Halogen-free,
Low Dk, Df |
Halogen-free,
Mid Dk, Df |
- *1.Measured by Triplate-Line Resonator
- *2.Measured by Materials Analyzer(IPC TM-650)
| Item |
Condition |
Unit |
MCL-FX-2 |
MCL-FX-2(S) |
MCL-FX-35 |
| Tg |
TMA |
°C |
175~185 |
175~185 |
280< |
| DMA |
– |
– |
– |
| CTE |
X |
30~120°C |
ppm/°C |
14~17 |
14~17 |
|
| Y |
14~17 |
14~17 |
|
| Z |
<Tg |
48~55 |
40~45 |
35~45 |
| >Tg |
80~130 |
60~100 |
– |
| Copper peel strength |
18μm |
A |
kN/m |
0.4~0.7(LP Profile) |
0.5~0.7(Standard) |
|
| 35μm |
0.4~0.8(LP Profile) |
0.7~1.0(Standard) |
|
| Solder heat resistance 260°C |
A |
sec. |
>300 |
>300 |
|
| Dielectric constant |
1MHz |
C-96/20/65 |
– |
3.50~3.70 |
3.60~3.80 |
|
| 1GHz*1 |
3.30~3.50 |
3.50~3.70 |
3.40~3.60 |
| 1GHz*2 |
3.50~3.70 |
3.55~3.75 |
3.50~3.55 |
| Dissipation factor |
1MHz |
C-96/20/65 |
– |
0.0005~0.0010 |
0.0010~0.0020 |
|
| 1GHz*1 |
0.0020~0.0030 |
0.0030~0.0040 |
0.0030~0.0040 |
| 1GHz*2 |
0.0010~0.0020 |
0.0020~0.0030 |
0.0020~0.0030 |
| Key word |
Low Dk, Df |
Low Dk, Df |
Low Water Absorption,
Double-Sided Materials |
- *1.Measured by Triplate-Line Resonator
- *2.Measured by Materials Analyzer(IPC TM-650)
Link of Materials for High Frequency Application
- MCL-LX-67YDetails
- MCL-LX-67FDetails
- MCL-LZ-71GDetails
- MCL-HE-679GDetails
- MCL-FX-2 SeriesDetails
- MCL-FX-35Details
 |