Base Materials for PWBs
Glass Epoxy Multilayer Materials
Glass Epoxy Multilayer Material is superior in heat resistance and applicable to lead-free soldering process. We offer a wider selection of materials, such as standard FR-4, high heat resistance, high insulation resistance, and halogen-free materials.
Materials for ICT infrastructure
A wide range of material is available from the ones for semiconductor package with low CTE, high elastic modulus and halogen free properties to the ones for high-layer count PWB with high heat resistance property for lead-free soldering process.
Polyimide Multilayer Material
Polyimide Multilayer Material,MCL-I-671, is composed of glass modified Polyimide resin, low-temperature curing type material which can be processed as conventional FR-4. Prepreg's resin flow control technology enables from high to low flow.