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Base Materials for PWBs

Materials for ICT infrastructure

A wide range of material is available from the ones for semiconductor package with low CTE, high elastic modulus and halogen free properties to the ones for high-layer count PWB with high heat resistance property for lead-free soldering process.

Materials for Fine Patterning

Suitable for fine line patterning by semi-additive process.


Copper Clad Laminate for tracking-Resistant composites.

Polyimide Multilayer Material

Polyimide Multilayer Material,MCL-I-671, is composed of glass modified Polyimide resin, low-temperature curing type material which can be processed as conventional FR-4. Prepreg's resin flow control technology enables from high to low flow.

Epoxy Adhesive Film

Low-Elastic Adhesive Film.

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