This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and Si chip.

• for TAB
• for Chip
• for Solderless connective film

Principle of connection

Applications

Interconnection between LCD and driver IC

Features

• Microscopic bump applicable
• High adhesion and high reliability
• Low contact resistance
• Short bonding time
• For low stress

Characteristics

Item		Unit	AC-8000 series
Application		-	for COG
Fine pitch capability	Min. contact area	μm2	1000
	Min. space	μm	10
Bonding condition	Temp.	°C	170~
	Time	sec	5~
	Pressure	MPa	50~150*

*Based on electrode area