
- This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and Si chip.
Principle of connection
Applications
Interconnection between LCD and driver IC
Features
- Microscopic bump applicable
- High adhesion and high reliability
- Low contact resistance
- Short bonding time
- For low stress
Characteristics
| Item |
Unit |
AC-8000 series |
| Application |
- |
for COG |
| Fine pitch capability |
Min. contact area |
μm2 |
1000 |
| Min. space |
μm |
10 |
Bonding
condition |
Temp. |
°C |
170~ |
| Time |
sec |
5~ |
| Pressure |
MPa |
50~150* |
*Based on electrode area
