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Anisotropic Conductive Films <ANISOLM> for COG

Image of for COG

This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and Si chip.

Principle of connection

SWF

Applications

Interconnection between LCD and driver IC

Features

  • Microscopic bump applicable
  • High adhesion and high reliability
  • Low contact resistance
  • Short bonding time
  • For low stress

Characteristics

Item Unit AC-8000 series
Application for COG
Fine pitch capability Min. contact area μm2 1000
Min. space μm 10
Bonding
condition
Temp. °C 170~
Time sec 5~
Pressure MPa 50~150*
*
Based on electrode area

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