This type improves reliability after IR reflow process.

• for TAB
• for COG
• for Solderless connective film

Principle of connection

Applications

Interconnection between LCD and driver IC through FPC

Features

• Fine pitch capability
• High reliability after IR reflow

Characteristics (Typical Values)

Item		Unit	AC-200 series
Application		-	for Chip
Fine pitch capability	Min. contact area	μm2	1500
	Min. space	μm	15
Bonding condition	Temp.	°C	220~
	Time	sec	5~
	Pressure	MPa	100*

*Based on electrode area