Products ListNews Releases

Electronics Related Products

Semiconductor Related Materials

Interlayer Dielectric Materials

HSG

CMP Slurry

for STI

for Metals

High Heat Resistant Fine Polyimides for VLSI

PIQ, PIX, PI, PL, HD Series

Die Bonding Paste

for Lead Frame

for Substrate

Die Bonding Film

DF, HS Series

Dicing Die Bonding Film

Underfill Film

Epoxy Molding Compounds

for Lead Frame

for Substrate

Liquid Encapsulants

CEL-C Series

High Heat Resistant Coating Materials

HL Series

for Screen Printing

LOC Tape

HM Series

Map Molding Support Tape

RT Series

Thermosetting Film for Electric Components

Release Sheet RM-4000 Series

Display & Optics-Related Materials

Anisotropic Conductive Film

for TAB

for COG

for Chip

for Solderless connective film

Optics Related Materials

Optical Polyimide Resin

Polymer Optical Waveguide

Base Materials for PWBs

Glass Epoxy Multilayer Material(FR-4)

High Heat Resistance Multilayer Material

Halogen Free Multilayer Material

High Tg Glass Epoxy Multilayer Material

High Elastic Modulus and Low CTE Multilayer Material

Halogen Free, High Elastic Modulus, Low CTE Multilayer Material

High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates

Low Dissipation Factor, High Heat Resistance Multilayer Material

Halogen Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material

Low Transmission Loss Material

Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance Multilayer Material

Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material

Glass Epoxy Copper Clad Laminate(FR-4)

Low Press Temperature, Adhesive Film

Photosensitive coverlay film "RAYTEC"
FR series for FPC

Photosensitive solder resist film "RAYTEC"
FZ series for PKG

Printed Wiring Boards

Package Substrate

High Layer and Large Size PWB

High Density Multi Wire Board <MWB>

PWB for IC Testers

Flexible PWB (Double Sided FPC)

Materials for Manufacturing
Process of PWBs

Photosensitive dry film "Photec"
RD series / DL series for direct imaging

Photosensitive dry film "Photec"
SL series for direct imaging

Photosensitive dry film "Photec"
RY series for PKG board

Photosensitive dry film "Photec"
H series for printed wiring boards

Photosensitive dry film "PHOTOCAST"
HM series for thick layer

Photosensitive coverlay film "RAYTEC"
FR series for FPC

Photosensitive solder resist film "RAYTEC"
FZ series for PKG

Copper Surface Roughening Chemicals for Multilayer PWB

Copper Surface Roughning Chemicals for Multilayer PWBs
(Black Oxide & Reduction Process)

Electroless Copper Plating Chemicals

Horizontal Electroless Copper Plating

Non Cyanide Type Electroless Gold Plating Chemicals

Others

Anode Material for Lithium Ion Batteries