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Products List : Functional MaterialsNews Releases

Semiconductor Related Materials

Interlayer Dielectric Materials: HSG
CMP Slurry: for STI; for Metals
High Heat Resistant Fine Polyimides for VLSI: PIQ, PIX, PI, PL, HD Series
Die Bonding Paste: for Lead Frame; for Substrate
Die Bonding Film: DF, HS Series; Dicing Die Bonding Film
Epoxy Molding Compounds: for Lead Frame; for Substrate
Liquid Encapsulants: CEL-C Series
High Heat Resistant Coating Materials: HL Series; for Screen Printing HP Series
LOC Tape: HM Series
Map Molding Support Tape: RT Series
Thermosetting Film for Electric Components: Release Sheet RM-4000 Series

Carbon Products / Ceramics

Lithium Ion Batteries: Anode Material for Lithium Ion Batteries
Carbon Brushes: Brushes for Automobile; Brushes for Appliance and Power Tool Motors; Brushes for Micro Motors
Carbon Materials: Carbon Sliding Materials; Active-material Paste for Capacitor "HITASOL"; Conductive Coating Materials "HITASOL"; Light-shading Coating Materials "HITASOL"; Lubricants and Release Agents "HITASOL"; Glass-like Carbon

Ceramics: Silicon Carbide (SiC) Ceramics; Alumina Ceramics; Zirconia Toughened Alumina Ceramics

Single Crystal: GSO Single Crystal Scintillator

Resins / Electrical Insulating Materials

Functional Resins: Saturated Polyester Resin; Epoxy Resin Hardeners; Endomethylene Tetrahydrophthalic Anhydride; Dicyclopentenyl Oxyethyl Acrylate; Functional Acrylic Resins
Molding Resins: Phenolic/DAP Resin Molding Compound
Electrical Insulating Materials: Insulating Varnishes; Void-free FRP

Functional Films

Advanced Film: Pressure Sensitive Adhesive Film; Adhesive Film for Display; Film for Semiconductor Related Products; Masking Film for a Plating Process; SPD Film "LCF-1103DHA"
RFID Products (IC Card & Tags): 13.56MHz High Frequency (HF); 2.45GHz Microwave Frequency (µ-Chip); 950MHz Ultra High Frequency (UHF-µ-Chip Hibiki etc.)
Foam Products: Cross-linked Foamed Polyethylene; Inorganic Dense-packed Foam; Foamed Polyethylene Thermal Insulation Sleeve
Food Wraps: Food Wrap for Consumer Use; Food Wrap for Commercial Use; Stretch Film for Food Wrap

Display Related Materials

Anisotropic Conductive Film: for TAB; for COG; for Solderless Connective Film
Transparent Conductive Transfer Film: MS series
Photosensitive Dry Film for Rib Patterning: MB series

Photovoltaic Related Materials

Conductive Film: CF Series
Interconnecting Paste: CP-300
Polyamide-imide type Insulating Paste: HP-300

Base Materials for PWBs

Glass Epoxy Multilayer Material: MCL-E-67; MCL-E-73; MCL-BE-67G Series; MCL-E-75G; Glass Epoxy Multilayer Material Characteristics
High Tg Glass Epoxy Multilayer Material: MCL-E-679 Type(W); MCL-E-679F Type(J); MCL-E-679F Type(R); MCL-E-679FG Series; MCL-E-679GT; MCL-E-700G Type(R); High Tg Glass Epoxy Multilayer Material Characteristics
Materials for High Frequency Application: MCL-LX-67Y; MCL-LX-67F; MCL-LZ-71G; MCL-HE-679G; MCL-FX-2 Series; MCL-FX-35; Materials for High Frequency Application Characteristics
High Thermal Conductivity PWB Materials: MCL-E-510G
Polyimide Multilayer Material: MCL-I-671
Flexible Substrate for Multilayer PWB: TC-C-300; MCF-5000I
Semi Additive Insulation Film: AS-Z3
Low Elasticity Adhesive Film: AS-2600/AS-2600W

Process Materials for PWBs

Photosensitive Dry Film "Photec" RD Series / DL Series for Direct Imaging

Photosensitive Dry Film "Photec" SL Series for Direct Imaging

Photosensitive Dry Film "Photec" RY Series for PKG Board

Photosensitive Dry Film "Photec" H Series for Printed Wiring Boards

Photosensitive Dry Film "PHOTOCAST" HM Series for Thick Layer

Photosensitive Coverlay Film "RAYTEC" FR Series for FPC

Photosensitive Solder Resist Film "RAYTEC" FZ Series for PKG

Photosensitive Liquid Solder Resist
SR7300 Series

Others

Contactless IC Cards and Tags: 13.56MHz High Frequency (HF); 2.45GHz Microwave Frequency (µ-Chip); 950MHz Ultra High Frequency (UHF-µ-Chip Hibiki etc.)