Electronics Related Products
- Glass Epoxy Multilayer Material(FR-4)
- High Heat Resistance Multilayer Material
- Halogen Free Multilayer Material
- High Tg Glass Epoxy Multilayer Material
- High Elastic Modulus and Low CTE Multilayer Material
- Halogen Free, High Elastic Modulus, Low CTE Multilayer
Material
- High Elastic Modulus, Low CTE Multilayer Materials
for Thin Package Substrates
- Low Dissipation Factor, High Heat Resistance
Multilayer Material
- Halogen Free, Low Dielectric Constant, Low Dissipation
Factor Multilayer Material
- Low Transmission Loss Material
- Low Dielectric Constant, Low Dissipation Factor,
High Heat Resistance Multilayer Material
- Halogen Free, Low Dielectric Constant, High Heat
Resistance Multilayer Material
- Glass Epoxy Copper Clad Laminate(FR-4)
- Low Press Temperature, Adhesive Film
- Photosensitive coverlay film "RAYTEC"
FR series for FPC
- Photosensitive solder resist film "RAYTEC"
FZ series for PKG
- Package Substrate
- High Layer and Large Size PWB
- High Density Multi Wire Board <MWB>
- PWB for IC Testers
- Flexible PWB (Double Sided FPC)
- Photosensitive dry film "Photec"
RD series / DL series for direct imaging
- Photosensitive dry film "Photec"
SL series for direct imaging
- Photosensitive dry film "Photec"
RY series for PKG board
- Photosensitive dry film "Photec"
H series for printed wiring boards
- Photosensitive dry film "PHOTOCAST"
HM series for thick layer
- Photosensitive coverlay film "RAYTEC"
FR series for FPC
- Photosensitive solder resist film "RAYTEC"
FZ series for PKG
- Copper Surface Roughening Chemicals for Multilayer
PWB
- Copper Surface Roughning Chemicals for Multilayer
PWBs
(Black Oxide & Reduction Process)
- Electroless Copper Plating Chemicals
- Horizontal Electroless Copper Plating
- Non Cyanide Type Electroless Gold Plating Chemicals
- Anode Material for Lithium Ion Batteries
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