Products List
Products Name List
A
- Adhesive Film For Display
- Alumina Ceramics
- Anisotropic Conductive Film
(for Chip) - Anisotropic Conductive Film
(for COG) - Anisotropic Conductive Film
(for Solderless connective film) - Anisotropic Conductive Film
(for TAB) - AnodeMaterial for Lithium Ion Batteries
B
- Brushes for Appliance and Power Tool Motors
- Brushes for Automobile
- Brushes for Automobile
- Brushes for Micro Motors
C
- Carbon Sliding Materials
- Ceramics Electrostatic Chuck (ESC)
- CMP Slurry (for Metals)
- CMP Slurry (for STI)
- Copper Surface Roughening Chemicals for Multilayer PWB
- Copper Surface Roughning Chemicals for Multilayer
PWBs
(Black Oxide & Reduction Process) - Cross-linked foamed polyethylene
D
- DAP resin molding compound
- Film For Semiconductor Related Products
- Dicing Die Bonding Film
- Dicyclopentenyl oxyethyl acrylate
- Die Bonding Film (DF, HS Series)
- Die Bonding Paste
(for Lead Frame) - Die Bonding Paste
(for Substrate)
E
- Electroless Copper Plating Chemicals
- Endomethylene tetrahydrophthalic anhydride
- Epoxy Molding Compounds
(for Lead Frame) - Epoxy Molding Compounds
(for Substrate) - Epoxy resin hardeners
F
- Flexible PWB (Double Sided FPC)
- Foamed polyethylene thermal insulation sleeve
- Food Wrap for Commercial Use <Hitachi Wrap>
- Food Wrap for Consumer Use <View Wrap 5>
G
- Glass Epoxy Copper Clad Laminate (FR-4)
- Glass Epoxy Multilayer Material (FR-4)
- Glass-like Carbon
- GSO Single Crystal Scintillator
H
- Halogen Free Multilayer Material
- Halogen Free, High Elastic Modulus, Low CTE Multilayer Material
- Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material
- Halogen Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material
- High Density Multi Wire Board <MWB>
- High Elastic Modulus and Low CTE Multilayer Material
- High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates
- High Heat Resistance Fine Polyimides for VLSI
- High Heat Resistant Coating Materials
- High Heat Resistant Coating Materials (for Screen Printing)
- High Heat Resistance Multilayer Material
- High Layer and Large Size PWB
- High Tg Glass Epoxy Multilayer Material
- Horizontal Electroless Copper Plating
I
L
- Large Size CaF2 Single Crystal for Lithography Lens
- Liquid Encapsulants
- LOC Tape
- Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance Multilayer Material
- Low Dissipation Factor, High Heat Resistance Multilayer Material
- Low Press Temperature, Adhesive Film (AS-2600)
- Low Transmission Loss Material
M
N
P
- Package Substrate
- Phenolic resin molding compound
- Photosensitive coverlay film "RAYTEC"
FR series for FPC - Photosensitive dry film "Photec"
H series for printed wiring boards - Photosensitive dry film "PHOTOCAST"
HM series for thick layer - Photosensitive dry film "Photec"
RD series / DL series for direct imaging - Photosensitive dry film "Photec"
RY series for PKG board - Photosensitive dry film "Photec"
SL series for direct imaging - Photosensitive solder resist film "RAYTEC"
FZ series for PKG - Planar antenna for forward looking radar system
- Pressure Sensitive Adhesive Film
- Protective film for automotive body
- PWB for IC Testers
R
- Rapid Onsite Toxicity Audit System
- Release Sheet RM-4000 Series
- RFID Products (IC Card & Tags)
for 13.56MHz High Frequency (HF) - RFID Products (IC Card & Tags)
for 2.45GHz Microwave Frequency
(μ-Chip) - RFID Products (IC Card & Tags)
for 950MHz Ultra High Frequency
(UHF - µ-Chip Hibiki etc.)
S
- Saturated polyester resin
- Silicon carbide (SiC) Ceramics
- SPD Film "LCF-1103DHA"
- Stretch Film for Food Wrap <Hitachi Wrap>
U
V
Z