Process Materials for PWBs
 - RD Series and DL series are fully aqueous applicable photosensitive films used for direct imaging system. These series have high photosensitivity, high resolution, excellent imaging property and other advantages than conventional films.
 - SL series are fully aqueous applicable photosensitive films used for UV laser direct imaging (UV-LDI) system. SL series have high photosensitivity, high resolution, excellent tenting property and other advantages than conventional films.
 - RY-3600 series are aqueous type photosensitive films used for high density semiconductor package such as BGA, CSP and so forth. RY-3600 series have excellent adhesion and resolution and less resist foot and the other advantage.
 - H-7000 series are aqueous type photosensitive films used for high density printed circuit board. H-7000 series can be applied to outer tenting and inner etching process. H-7000 series have excellent tenting ability which is helpful in improving yield.
 - HM series were developed for electro-forming such as metal mask.They have an excellent resolution which contributes fine pattern thick plating.
 - It is a photosensitive coverlay film that has excellent flexibility and low warpage developed for ultra-high-density FPC such as the cellular phone, the digital camera, and medical equipment.
 - FZ series are dry film type photosensitive solder resist with high reliability developed for PKG, which have excellent HAST resistance, TCT resistance and PCT resistance, etc.
 - SR7300 series is a highly reliable solder resist for package substrates.
It enables substrates to be thinner and finer because of its excellent HAST and TCT resistance even in thin resist layers.
 |
