Electronics Related Products >> Materials for Manufacturing Process of PWBs
Electroless Copper Plating Chemicals
- Our electroless copper plating system is good for PWB plating with higher density and smaller through-hole.
Features
- Good plating for the small diameter via and through-hole.
- High reliability on the inner layer connection, when using in high temperature solder.
- High stability of electroless copper solution.
| Items | Conditions | Units | Characteristics |
|---|---|---|---|
| Thickness | 15min. | μm | >0.3 |
| Through-hole Covering | Back Light Test | – | Pass |
| Thermal Stress for Inner Connection | 288ºC /10s/9cycles,Solder Float (FR-4, T1.6mm, ø0.3mm) |
– | Pass |
| Adhesion | – | – | Pass |
| Color | – | – | Pink |
 |
 Plating for High Aspect BoardFR-4 Board Thickness 3.2mm Hole Diameter 0.3mm |
 Back light result high Tg materialafter Erectoroless plating MCL-E-679 Board Thickness 1.6mm Hole Diameter 0.3mm |
Applications
- Through-hole Plating for PWBs