Our electroless copper plating system is good for PWB plating with higher density and smaller through-hole.

Features

• Good plating for the small diameter via and through-hole.
• High reliability on the inner layer connection, when using in high temperature solder.
• High stability of electroless copper solution.

Items	Conditions	Units	Characteristics
Thickness	15min.	μm	>0.3
Through-hole Covering	Back Light Test	–	Pass
Thermal Stress for Inner Connection	288ºC /10s/9cycles,Solder Float (FR-4, T1.6mm, ø0.3mm)	–	Pass
Adhesion	–	–	Pass
Color	–	–	Pink

	Plating for High Aspect Board FR-4 Board Thickness 3.2mm Hole Diameter 0.3mm
	Back light result high Tg material after Erectoroless plating MCL-E-679 Board Thickness 1.6mm Hole Diameter 0.3mm

Applications

• Through-hole Plating for PWBs