Our electroless copper plating system is good for PWB plating with higher density and smaller through-hole.

Features

• Good plating for the small diameter via and through-hole.
• Excellent inner layer connection reliability even with high temperature soldering.
• High stability of electroless copper solution.

Specifications

Item	Condition	Unit	Characteristic
Thickness	15min.	μm	>0.3
Through-hole Covering	Back Light Test	–	Pass
Thermal Stress for Inner Connection	288ºC /10s/9cycles,Solder Float (FR-4, T1.6mm, ø0.3mm)	–	Pass
Adhesion	–	–	Pass
Color	–	–	Pink

		Plating for High Aspect Board Board Thickness : 3.2mm Hole Diameter : ø0.30mm Base material : FR-4
		Back light result of high Tg materials after Erectroless plating Board Thickness : 1.6mm Hole Diameter : ø0.30mm Base material : MCL-E-679

Applications

• Through-hole Plating for PWBs.

Catalogues / Technical Data

Catalogue Data(PDF)

Electroless Copper Plating ChemicalsPDF(409KB)