Electronics Related Products >> Materials for Manufacturing Process of PWBs
Horizontal Electroless Copper Plating
- Horizontal plating process yield the metalization of highly reliable microvias as well as improving work environment and easy processing of thin materials.
Features
- High reliability in the inner layer connection, and suitable for lead-free application, which has high melting point.
- Copper deposit uniformly toward the high aspect ratio through-hole and the microvia circuit board.
- Using liquid type product instead of salt when catalyst reacts, thus easy to operate and can prevent the nozzle choking.
Uniformly treatment is possible.
| Items | Conditions | Hitachi Chemical |
|---|---|---|
| Copper deposition to roll (2 weeks) |
– | Non copper deposit |
| Inner layer connection | 288ºC /10s/9cycle Solder Float |
Pass |
| Waste treatment of plating solution |
– | Easy |
 |
 High aspect ratio of through-hole boardBoard Thickness : 4.2mm Hole Diameter : ø0.30mm (Base Material : FR-4) |
 Microvia BoardDepth : 0.12mm Hole Diameter : ø0.12mm |
Applications
- Through-hole plating for PWBs.