Horizontal plating process yield the metalization of highly reliable microvias as well as improving work environment and easy processing of thin materials.

Features

• High reliability in the inner layer connection, and suitable for lead-free application, which has high melting point.
• Copper deposits uniformly toward the high aspect ratio through-hole and the microvia circuit board

Specifications

Item	Condition	Characteristic
Copper Deposition to Roll（l 1week）	–	Non copper deposit
Inner layer connection	288ºC /10s/10cycles Solder Float	Pass
Waste treatment of plating solution	–	Easy

		High aspect ratio of through-hole board Board Thickness : 4.2mm Hole Diameter : ø0.30mm (Base Material : FR-4)
		Microvia Board Depth : 70μm Hole Diameter : ø70μm

Applications

• Through-hole Plating for PWBs.

Catalogues / Technical Data

Catalogue Data(PDF)

Horizontal Electroless Copper Plating ChemicalsPDF(407KB)