Horizontal plating process yield the metalization of highly reliable microvias as well as improving work environment and easy processing of thin materials.

Features

• High reliability in the inner layer connection, and suitable for lead-free application, which has high melting point.
• Copper deposit uniformly toward the high aspect ratio through-hole and the microvia circuit board.
• Using liquid type product instead of salt when catalyst reacts, thus easy to operate and can prevent the nozzle choking.
  Uniformly treatment is possible.

Items	Conditions	Hitachi Chemical
Copper deposition to roll (2 weeks)	–	Non copper deposit
Inner layer connection	288ºC /10s/9cycle Solder Float	Pass
Waste treatment of plating solution	–	Easy

	High aspect ratio of through-hole board Board Thickness : 4.2mm Hole Diameter : ø0.30mm (Base Material : FR-4)
	Microvia Board Depth : 0.12mm Hole Diameter : ø0.12mm

Applications

• Through-hole plating for PWBs.