RY-3600 series are aqueous type photosensitive films used for high density semiconductor package such as BGA, CSP and so forth. RY-3600 series have excellent adhesion and resolution and less resist foot and the other advantage.
Features
These films are suitable for semi-additive process with high adhesion, high resolution and stable line width.
Shorter resist foot can contribute to finer pattern manufacturing. Excellent resist profile (smooth resist side wall) results in smooth plating line profile.
Photo characteristics
Item
Unit
RY-3625
RY-3525
Thickness
μm
25
25
Photosensitivity*1
mJ/cm2
95
110
Adhesion*1(L/S=x/3x)
μm
8
10
Adhesion*1(L/S=x/1000)
μm
9
11
Resolution*1(L/S=3x/x)
μm
9
10
Stripping time*2
sec.
33
48
Stripped flake size*2
—
5
2
*1:Exposure energy:ST=14/41
*2:12vol% R-100S(Mitsubishi Gas Chemical Ltd.)
Pattern profile(RY-3625)
Plating profile after resist stripping L/S=7µm/7µm
