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Photosensitive Dry Film "PHOTEC"H Series for Printed Wiring Boards

Image of H Series for Printed Wiring Boards

H-7000 series are aqueous type photosensitive films used for high density printed circuit board. H-7000 series can be applied to outer tenting and inner etching process. H-7000 series have excellent tenting ability which is helpful in improving yield.

Features

  • Excellent tenting performance is helpful in improving yield.
  • High photosensitivity can contribute to improving trough-put performance.
  • Excellent adhesion is effective in decreasing the defect of circuit.
Photo characteristics
Item Unit H-7025 H-7030 H-7034 H-7038 H-7045 H-6238
Sensitivity*1 mJ/cm2 50 60 60 60 66 50
Minimum developing time*2 sec. 16 20 24 27 32 30
Adhesion*2 x/400μm 12 15 18 20 27 25
Resolution x/xμm 32 35 35 37 45 37
Breakage ratio of triple hole*3 %, Ø6mm 83 63 56 44 22 94
*1:
ST=23/41, Exposure energy for recommended ST in 41ST of Hitachi step tablet by collimated light (ORC manufacturing Co., Ltd.).
*2:
1wt%Na2CO3,30°C, Minimum developing time×2, Hitachi test pattern, Collimated light
*3:
ST=23/41, (Minimum developing time×6)

Resist profile(H-7034)
L/S=40μm/40μm, ST=23/41

Hole profile

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