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Photosensitive Dry Film "PHOTEC"HM Series for Thick Resist Layer

Image of HM Series for Thick Resist Layer

HM series are photosensitive films to form a thick resist layer with higher aspect ratio.
They are used for electro-forming such as metal mask.

Features

  • Excellent resolution and adhesion make it possible to form a resist with higher aspect ratio.
  • Thickness lineup according to the application (thickness; 35~200μm, available upon request)
  • Smooth sidewall of plating line due to the smooth resist profile.
(One of our data)
Items Units HM-4000series
(For Contact Exposure)
HM-6000series
(For Direct Imaging Exposure)
HM-4056 HM-4075 HM-40112 HM-6050 HM-60100
Thickness of resist μm 56 75 112 50 100
Exposure energy mJ/cm2 85 130 270 150 500
Extra high pressure mercury lamp*1 Direct imaging (355nm)*2
Adhesion(L/S=x/400) μm 22 35 32 25 45
Resolution(L/S=x/x) μm 25 35 50 25 60
*1:
Collimated light type
*2:
Direct imaging exposure machine:Orbotech Japan Co., Ltd.

Resist profile


HM-4056
Resist thickness:56μm
Φ=30μm


HM-40112
Resist thickness:112μm
L/S=180/30μm

HM-40112
Resist thickness:112μm
Resist diameter:Φ=30μm (Space:40μm)

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