- It is a photosensitive coverlay film that has excellent flexibility and low warpage developed for ultra-high-density FPC such as the cellular phone, the digital camera, and medical equipment.
Features
- This film has flame resistance (UL94 VTM-0) without halogenous and antimony compounds.
- This film has excellent flexibility and low warpage performance to reduce
springback problem.
Photo characteristics
| Item |
Condition |
Unit |
FR-7025 |
FR-7038 |
FR-7050 |
| Thickness |
— |
μm |
25 |
38 |
50 |
| Min. development time |
1%Na2CO3 30°C |
sec. |
24 |
38 |
51 |
| Sensitivity |
ST=23/41 |
mJ/cm2 |
90 |
110 |
130 |
| Resolution |
RP-1(L/S=n/n) *1 |
μm |
40 |
50 |
60 |
| Via resolution |
μmØ |
70 |
80 |
90 |
*1:Photo mask : Hitachi Test Pattern G-2 and Test Pattern for RAYTEC (PET type)
Physical Properties
| Item |
Condition |
FR-7038 |
| Surface hardness |
Pencil hardness |
2H |
| Resistance to bending |
The count of bending to 180 degrees |
3~5times |
| Heat resistance to solder |
300°C/10sec./1cycle |
pass |
| Warpage |
After curing *2 |
≦5mm |
| Resistance to plating |
Electroplating(Ni/Au=3.0/0.1μm) |
pass |
| Electroless plating(Ni/Au=3.0/0.1μm) |
pass |
| Flame resistance |
UL94 VTM Method |
VTM-0*3 |
| Insulation resistance |
85°C/85%/30V/1000hr
L/S:50/50μm,Cu foil:18μmt |
≧1.0E+08 |
*2:Single side formation of cured photosensitive
coverlay on polyimide (PI) film (25μmt)
*3:Combination with adhesiveless FCCL
| Via shape(FR-7038) |
Warpage(FR-7038) |
 |
 |
| Ø100μm |
|
