SR7300 series is a highly reliable solder resist for package substrates.
It enables substrates to be thinner and finer because of its excellent HAST and TCT resistance even in thin resist layers.

Features

• Excellent Reliability (HAST & TCT)
• Low Warpage
• Fine Via-hole Resolution
• Halogen Free
• LDI Compatible

Example of Application

Example of Flip Chip BGA Package

Characteristics

Item	Condition	Unit	SR7300G	SR7200G	Conventional
SRO Resolution	Mask diameter 50μm	μm	35	42	42
Solder Dip Resistance	10sec at 260°C	-	OK	OK	OK
TCT Resistance	1000cycle(-55°C～125°C)	-	OK	OK	NG
	3000cycle(-55°C～125°C)	-	OK	NG	NG
PCT Resistance	121°C×100%RH×2atm×288h	-	OK	OK	OK
HAST Resistance	131°C×85%RH×2.8atm×14V×288h	Ω	>12×1.010	>12×1.010	>2.5×1.08
Glass Transition Temp.	DMA	°C	174	107	100
Young Modulus	-	Mpa	2400	2600	2600
Elongation	-	%	4.2	3.2	1.8
Tensile Strength	-	Mpa	95	70	25

Applications

• Solder Mask for Printed Wiring Board