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Electronics Related Products >> Materials for Manufacturing Process of PWBs

Materials for Manufacturing Process of PWBs

Photosensitive dry film "Photec"

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RD series and DL series are fully aqueous applicable photosensitive films used for direct imaging system. These series have high photosensitivity, high resolution, excellent imaging property and other advantages than conventional films.

Photosensitive dry film "Photec"

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SL series are fully aqueous applicable photosensitive films used for UV laser direct imaging (UV-LDI) system. SL series have high photosensitivity, high resolution, excellent tenting property and other advantages than conventional films.

Photosensitive dry film "Photec"

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RY-3600 series are aqueous type photosensitive films used for high density semiconductor package such as BGA, CSP and so forth. RY-3600 series have excellent adhesion and resolution and less resist foot and the other advantage.

Photosensitive dry film "Photec"

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H-7000 series are aqueous type photosensitive films used for high density printed circuit board. H-7000 series can be applied to outer tenting and inner etching process. H-7000 series have excellent tenting ability which is helpful in improving yield.

Photosensitive dry film "PHOTOCAST"

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HM series were developed for electro-forming such as metal mask.They have an excellent resolution which contributes fine pattern thick plating.

Photosensitive coverlay film "RAYTEC"

Photosensitive coverlay film RAYTEC
It is a photosensitive coverlay film that has excellent flexibility and low warpage developed for ultra-high-density FPC such as the cellular phone, the digital camera, and medical equipment.

Photosensitive solder resist film "RAYTEC"

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FZ series are dry film type photosensitive solder resist with high reliability developed for PKG, which have excellent HAST resistance, TCT resistance and PCT resistance, etc.

Copper Surface Roughening Chemicals for Multilayer PWB

HIST-7300 is the chemical roughening agent for multi-layer process which is developed as alternative to black oxide treatment process. It provides strong adhesion between resin and copper surface.

Copper Surface Roughning Chemicals for Multilayer PWBs
(Black Oxide & Reduction Process)

HIST-500, HIST-100 is black oxide and reduction process chemicals for multilayerPWB.
It attains good adhesion between resin and copper by minute roughening form of metal copper, and realize high reliable PWBs without haloing.

Electroless Copper Plating Chemicals

Our electroless copper plating system is good for PWB plating with higher density and smaller through-hole.

Horizontal Electroless Copper Plating

Horizontal plating process yield the metalization of highly reliable microvias as well as improving work environment and easy processing of thin materials.

Non Cyanide Type Electroless Gold Plating Chemicals

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HGS-5400 is the electroless gold plating chemicals which is non-cyanide,very stable and long life. This electroless gold plating has good wire-bonding reliability.
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