Page Link

Advanced FilmsFilm for Semiconductor Related Products

Image of Film for Semiconductor Related Products

HAE Series
Dicing film is an adhesive tape to hold and protect semiconductor wafers from the dicing process to the pickup process. Especially this stretchable film improves the efficiency in the pickup process. Various grades are available to suit the cutting method and the chip size.
RM Series
Release sheet reduces the flash burr in molding of QFN packages etc.

Features

  • Various choice of adhesive strength. We are ready to serve a lot of kinds of film and the adhesion strength for various purposes.
  • Good at expanding.
  • Adhesion type and no UV treatment required.
  • Little contamination to a wafer.

Applications

  • Holding the tips of wafer from dicing process to the pick up process.

Standard Specification

HAE-1500 series

Item Unit HAE-
1525
HAE-
1503L
HAE-
1503
HAE-
1503H
HAE-
1504
HAE-
1505
HAE-
1506
Standard adhesion gf/25mm 35 40 50 58 80 130 250
Dimension Thickness µm 80
Width mm 150
Length m 100
Hue of film -  
Material of film - PVC
Material of separator - PAPER
properties of machine Tensile stregth kgf/cm2 260
Elongation % 260
Elastic modulus kgf/mm2 5.4
50% modulus kgf/cm 0.7
Size of chips - large<>small

Note :Standard adhesion means an adhesion to the adherend for which SUS430-BA plate used,and was measured at an exfoliation angle of 90° an exfoliation speed of 200 mm/min and a temperature of 23°C. Unless otherwise specially indicated, the data are those measured under the same conditions as above.

HAE-1600 series

Item Unit HAE-
1625
HAE-
1603L
HAE-
1603
HAE-
1603H
HAE-
1604
HAE-
1605
HAE-
1606
Standard adhesion gf/25mm 35 40 50 58 80 130 250
Dimension Thickness µm 80
Width mm 150
Length m 100
Hue of film -  
Material of film - PVC
Material of separator - OPP film
properties of machine Tensile stregth kgf/cm2 260
Elongation % 260
Elastic modulus kgf/mm2 5.4
50% modulus kgf/cm 0.7
Size of chips - large<>small

Note :Standard adhesion means an adhesion to the adherend for which SUS430-BA plate used,and was measured at an exfoliation angle of 90° an exfoliation speed of 200 mm/min and a temperature of 23°C. Unless otherwise specially indicated, the data are those measured under the same conditions as above.

Release Sheet RM-4100

Features

  • RM-4100 is suitable for the general sheet type molding machine.
  • Flat and fine surface is produced by using RM-4100 because the shape of sheets is very stable in the molding process. RM-4100 is tough to wrinkle and the change of the shape by clamping pressure is also small.
  • The particular release layer holds lead frames and terminals tightly to prevent the invasion of epoxy molding compound, and the incidence of the flash burr is dramatically decreased.

Characteristics

Item Unit RM-4100
Structure - Release layer
Base Film
Thickness mm 0.04
Tensile strength MPa 40
Tensile elongation % 50
Width mm 50~300
Length m 100
Product - Roll(Diameter:Approx.12cm)

Molding Process


Loading RM-4100 and lead frame with chips on mold machine.


Transferring mold resin into cavities after closing and clamping the molds tightly.

Opening the molds and removing the molded lead frame.

*
The above datasheet is a sample observation value under certain testing conditions, not guaranteed performance.

About Our Products

  • Contact Us
  • Page Top