Hitachi Chemical's Polyamide-imide type Insulating Paste "HP-300" exercises its strength in insulation between electrodes on Back-contact type cells. Soluble resin fillers dispersed in polyamide-imide type vanish form uniform film; and realize excellent mechanical strength and insulation properties.

Product Design Concept

Features

• Polyamide-imide type varnish realizes high heat resistance which is essential on production process of Back-contact type cells.
• Soluble resin fillers dispersed in polyamide-imide type vanish form uniform film and realize excellent mechanical strength and insulation properties.
• Screen printing realizes patterning with low cost.

Potential Application for Back-contact type Cell

Properties

Item		Unit	HP-300	Conventional Paste (Ref.)
Paste properties	Base resin	–	Polyamide-imide	Polyimide
	Filler	–	Soluble resin filler	Silica filler
	Storage condition	–	RT	Freezer
Curing condition		°C/min	200/60 ~ 250/5	200/60
Cured film properties	Tensile strength	MPa	100	87
	5% weight loss temp.	°C	410	410
	Breakdown voltage	V/µm	230	10