Photovoltaic Related Materials
 - "CF" is conductive film for interconnecting electrodes on PV cells and tab ribbons, substitute for solder. Low temp. interconnection can reduce warpage and break of cells, and contributes to improve productivity of modules. CF also enables to apply a technology of cell without bus bars (Ag paste).
 - "CP-300" is a paste, whose low temp. melting metal particles are dispersed in thermosetting resin. It interconnects electrodes on cells and tab ribbons, substitute for solder. Melted metal particles self-align and form metal interconnection; and thermosetting resin reinforces surrounding area of the interconnection to achieve stronger adhesion. Thus highly reliable interconnection can be formed.
This interconnecting paste reduces break, warpage of cells and no flux residue. Also narrow-bus-bar and bus-bar-less technology, leading to reduction of Ag, can be applied.
 - Hitachi Chemical's Polyamide-imide type Insulating Paste "HP-300" exercises its strength in insulation between electrodes on Back-contact type cells. Soluble resin fillers dispersed in polyamide-imide type vanish form uniform film and realize excellent mechanical strength and insulation properties.
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