Electronics Related Products >> Printed Wiring Boards
Package Substrate
- By utilizing proprietary technologies of ultra fine line wiring and electroless gold plating, we can make high density PWBs. Also, we can contribute to the thin layer formation with varieties of material selection,semi-additive and coreless technology.
Features
- Line/Space=25/25μm is possible by the semi-additive method.
- Capable for thin board with t0.66mm core material
- Higher density design possible due to no plating lead by using electroless gold olafing.
- The selection of base material such as high elastic modulus, low DK, high heat resistance and halogen-free are available.
Structure
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9.5Applications
- Flip chip BGA
- Multi chip module / System in Package / Package on Pakage
Ultra Thin Build up Board
Features
- Realizes t0.17mm board thickness at 4-layer by using t0.04mm base materials.
- The first layer is flat surface, and it is possible to make via on pad structure.
- Producing stacked via on filled via is available.
