By utilizing proprietary technologies of ultra fine line wiring and electroless gold plating, we can make high density PWBs. Also, we can contribute to the thin layer formation with varieties of material selection,semi-additive and coreless technology.
Features
Line/Space=25/25μm is possible by the semi-additive method.
Capable for thin board with t0.66mm core material
Higher density design possible due to no plating lead by using electroless gold olafing.
The selection of base material such as high elastic modulus, low DK, high heat resistance and halogen-free are available.
Structure
Item
Unit
Specification
Material
-
MCL-E-679F
Solder resist
-
PSR4000AUS308
Number of
layer
layer
6(2-2-2)
Total board
thickness
mm
0.40
lazer via dia.
mm
ø0.08
Min.line/space
μm
25/25
Terminal line
pitch
μm
90
Terminal top
width
μm
<60
Item
Unit
Specification
Material
-
MCL-E-679,
MCL-E-679F
Cavify size
mm
9.5
Cavify depth
mm
<0.45
Total board
thickness
mm
0.65
lazer via dia.
mm
ø0.1
Min.line/space
μm
25/25
Terminal line
pitch
μm
85
Terminal top
width
μm
<55
Applications
Flip chip BGA
Multi chip module / System in Package / Package on Pakage
Ultra Thin Build up Board
Features
Realizes t0.17mm board thickness at 4-layer by using t0.04mm base materials.
The first layer is flat surface, and it is possible to make via on pad structure.
9.5