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High Layer PWB

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A multilayer board suitable for applications requiring higher density and increase in number of layers with electroless copper plating technology.

Features

  • Minimum line/space is 0.10/ 0.15(mm), and available to make up to 50 layer.
  • Applicable up to the size 600 × 500(mm).
  • By using electroless copper plating method which is original lo Hitachi Chemical excellent in plating process of the through-hole that has high aspect ratio, Press-fit mounting and maximum board thickness up to 6.3 mm can be achieved to make product of high-density multilayer PWBs.
Items Units High Layer Borad Lage Size Boad Microvia Board
Max.size mm 580×480 600×550 285×235
Max.board thickness mm 6.3 6.3 3.2
Number of layer Layer 50 30 20
Laine/Spase μm 90/100 130/180 100/100
Min.via diameter mm ø0.25 ø0.35 ø0.1
Hole Pia. tolerance μm ±50 ±50 ±50
Green material -


56-layer
Cross Section
Material:E-679


16-layer
Cross Section
Material:E-679F(J)


40-layer
Cross Section
Halogen-free PWB
Material:BE-67G(H)


HDI 14-layer
Cross Section
High Frequency PWB
Material:LX-67

Applications

  • Tester, Switching equipment, Server, Backplane etc.

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