A multilayer board suitable for applications requiring higher density and increase in number of layers with electroless copper plating technology.
Features
Minimum line/space is 0.10/ 0.15(mm), and available to make up to 50 layer.
Applicable up to the size 600 × 500(mm).
By using electroless copper plating method which is original lo Hitachi Chemical excellent in plating process of the through-hole that has high aspect ratio, Press-fit mounting and maximum board thickness up to 6.3 mm can be achieved to make product of high-density multilayer PWBs.
