Electronics Related Products >> Printed Wiring Boards
High Layer PWB
- A multilayer board suitable for applications requiring higher density and increase in number of layers with electroless copper plating technology.
Features
- Minimum line/space is 0.10/ 0.15(mm), and available to make up to 50 layer.
- Applicable up to the size 600 × 500(mm).
- By using electroless copper plating method which is original lo Hitachi Chemical excellent in plating process of the through-hole that has high aspect ratio, Press-fit mounting and maximum board thickness up to 6.3 mm can be achieved to make product of high-density multilayer PWBs.
| Items | Units | High Layer Borad | Lage Size Boad | Microvia Board |
|---|---|---|---|---|
| Max.size | mm | 580×480 | 600×550 | 285×235 |
| Max.board thickness | mm | 6.3 | 6.3 | 3.2 |
| Number of layer | Layer | 50 | 30 | 20 |
| Laine/Spase | μm | 90/100 | 130/180 | 100/100 |
| Min.via diameter | mm | ø0.25 | ø0.35 | ø0.1 |
| Hole Pia. tolerance | μm | ±50 | ±50 | ±50 |
| Green material | - | ๐ | ๐ | ๐ |
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| 56-layer Cross Section Material:E-679 |
16-layer Cross Section Material:E-679F(J) |
40-layer Cross Section Halogen-free PWB Material:BE-67G(H) |
HDI 14-layer Cross Section High Frequency PWB Material:LX-67 |
Applications
- Tester, Switching equipment, Server, Backplane etc.