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High Density Multi Wiring Board <MWB>

Image of <MWB>

Multi Wiring Board, is a PWB where copper wire pre-insulated with a polyimide resin is embedded in the insulation layer by a wiring machine to form a circuit.
Multi Wiring Board allows cross wiring so that the number of wires containable in one layer significantly increases, and consequently an high-density board can be manufactured with a smaller number of layers than an ordinary PWBs. In addition, as Multi Wiring Board uses copper wire of a uniform diameter, it is superior in various electric characteristics such as providing stable characteristic impedance. Multi Wiring Board has characteristics of equal length wiring between high speed CPUs. Comparing with the PWBs using etching method, easy pattern designing can be achieved with MWB.

Features

  • Achieve high density wiring and reduction in number of layer by using the method of crossovers of the insulated wire.
  • Reduce the development time due to the easy process of wiring pattern, and easy to change the wiring pattern.
  • Realize the design characteristics easily because of the uniformity of wire diameter.
Item Units Spec.
Wire Density - 3wires/1.27mm,
2wires/0.915mm,
1wire/0.65mm
Wire diameter μm Ø80、Ø100(Tolerance±3μm)
Wiring layers Layer 2~12
Power/Grand plane layers Layer 2~26
Max. borad size mm×mm 600×550
Max. board thickness mm 6.3 5.0
Min. drilling diameter mm Ø0.30(Ø0.25*) Ø0.25
Characteristics Impedance - ±5~10%
Equal Length wiring - Accuracy±1.27mm
Crosstalk - <2 %(Tr=1ns)

*Under Development

Comparison of Propagation Loss

Applications

  • High-end Computer, Switching Equipment, IC Tester, Probe Card etc.

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