Electronics Related Products >> Printed Wiring Boards
FPC (Double Sided FPC)
- Realizing more flexible strueture.
Features
- Available for less than 100 μm at board thickness.
- Desirable performance in bendability by using our original thermosetting solder resist.
- Available for high density package by applying light stiffening film.
- No need for plating lead by applying electroless Ni+Au plating.
| Item | Thin type | Double type | Light Stiffening | Fine Line type | ||
|---|---|---|---|---|---|---|
| Base material | Polyimide base material | Adhesiveless | Adhesiveless | Adhesiveless | Adhesiveless | |
| Solder resist | Side A | Light Stiffening | Light Stiffening Film | Light Stiffening | Light Stiffening | |
| Side B | Heat Stiffening | Light Stiffening Film | Cover-lay | Cover-lay | ||
| Pattern | Pattern Pitch (μm) | 100 | 100 | 100 | 60 | |
| Line width accuracy (μm) | ±20 | ±20 | ±20 | ±10 | ||
| Terminal | Pattern Pitch (μm) | 120 | 120 | 120 | 120 | |
| Top width accuracy (μm) | ±30 | ±30 | ±30 | ±20 | ||
| Measurement accuracy (%) | ±0.1 | ±0.1 | ±0.1 | ±0.08 | ||
| Through-hole | Min. via dia. (ømm) | 0.1 | 0.15 | 0.12 | 0.1 | |
| Surface finishing | Electroless Nickel / Gold Plating | Electroless Nickel / Gold Plating | Electroless Nickel / Gold Plating | Electric Gold Plating | ||
| Green material | ๐ | ๐ | ๐ | ๐ | ||
Structure for Double Sided
Double Sided FPC with Shield Layer
Developing FPC with Shield layer against EMI.
| Item | Unit | 3 Layer, 4 Layer Type |
|---|---|---|
| Base material | - | Adhesiveless Copper Clad Material ∙ Polyimide Cover-lay Film ∙ Conductive Cover-lay Film |
| No. of shield layer | Layer | 1, 2 |
| Resistance of shield layer | mΩ/ |
<300 |
| Min. via dia of shield layer | ømm | 2.4 |
| Max. board thickness | mm | 3 layers :0.16 4 layers :0.2 |
| Min. line/space | μm | 40/60 |
| Min. via dia. | ømm | 0.15 |
| Surface finishing | - | Electroless Nickel / Gold Plating / Direct Gold Plating |
Cross Section Structure
