FPC (Double Sided FPC)

 Product Inquiry
Image of Flexible PWB
Realizing more flexible strueture.

Features

  • Available for less than 100 μm at board thickness.
  • Desirable performance in bendability by using our original thermosetting solder resist.
  • Available for high density package by applying light stiffening film.
  • No need for plating lead by applying electroless Ni+Au plating.
Item Thin type Double type Light Stiffening Fine Line type
Base material Polyimide base material Adhesiveless Adhesiveless Adhesiveless Adhesiveless
Solder resist Side A Light Stiffening Light Stiffening Film Light Stiffening Light Stiffening
Side B Heat Stiffening Light Stiffening Film Cover-lay Cover-lay
Pattern Pattern Pitch (μm) 100 100 100 60
Line width accuracy (μm) ±20 ±20 ±20 ±10
Terminal Pattern Pitch (μm) 120 120 120 120
Top width accuracy (μm) ±30 ±30 ±30 ±20
Measurement accuracy (%) ±0.1 ±0.1 ±0.1 ±0.08
Through-hole Min. via dia. (ømm) 0.1 0.15 0.12 0.1
Surface finishing Electroless Nickel / Gold Plating Electroless Nickel / Gold Plating Electroless Nickel / Gold Plating Electric Gold Plating
Green material ๐ ๐ ๐ ๐

Structure for Double Sided

Double Sided FPC with Shield Layer

Developing FPC with Shield layer against EMI.

Item Unit 3 Layer, 4 Layer Type
Base material - Adhesiveless Copper Clad Material ∙ Polyimide Cover-lay Film ∙ Conductive Cover-lay Film
No. of shield layer Layer 1, 2
Resistance of shield layer mΩ/ <300
Min. via dia of shield layer ømm 2.4
Max. board thickness mm 3 layers :0.16      4 layers :0.2
Min. line/space μm 40/60
Min. via dia. ømm 0.15
Surface finishing - Electroless Nickel / Gold Plating / Direct Gold Plating

Cross Section Structure

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