Printed Wiring Boards

Package Substrate

By utilizing proprietary technologies of ultra fine line wiring and electroless gold plating, we can make high density PWBs. Also, we can contribute to the thin layer formation with varieties of material selection,semi-additive and coreless technology.

High Layer PWB

A multilayer board suitable for applications requiring higher density and increase in number of layers with electroless copper plating technology.

High Density Multi Wiring Board <MWB>

Multi Wiring Board, is our original PWB where copper wire pre-insulated with a polyimide resin is embedded in the insulation layer by a wiring machine to form a circuit.

PWB for IC Testers

The probe card makes it possible to use Multi-wire technology, improve the timing accuracy and low-crosstalk design by high precision, equal length wiring of characterictic impedance.

FPC(Double Sided FPC)

Realizing more flexible strueture.