Electronics Related Products >> Semiconductor Related Materials
Interlayer Dielectric Materials
HSGInquiry
- "HSG" is a new spin on material (SOG) which is effective on high-speed devices with ULSI multilevel interconnections. It provides excellent properties:
high mechanical strength and low water absorption.
Features
- High mechanical strength and low dielectric constant.
- High heat resistance (≧500°C).
- HSG-255 can withstand etching, ashing and CMP process.
Characteristics (Typical Values)
| Item | Test condition | Unit | HSG-255 | HSG-R7 |
|---|---|---|---|---|
| Dielectric constant | 1MHz | – | 2.3 | 2.8 |
| Elastic modulus | Nano indentation | GPa | 12 | 4.7 |
| Water absorption | TDS 23°C~600°C | wt% | <0.2 | <0.2 |
Cross section SEM of HSG-255/Cu Single-damascene
