"HSG" is a new spin on material (SOG) which is effective on high-speed devices with ULSI multilevel interconnections. It provides excellent properties:
high mechanical strength and low water absorption.

Features

• High mechanical strength and low dielectric constant.
• High heat resistance (≧500°C).
• HSG-255 can withstand etching, ashing and CMP process.

Characteristics (Typical Values)

Item	Test condition	Unit	HSG-255	HSG-R7
Dielectric constant	1MHz	–	2.3	2.8
Elastic modulus	Nano indentation	GPa	12	4.7
Water absorption	TDS 23°C~600°C	wt%	<0.2	<0.2

Cross section SEM of HSG-255/Cu Single-damascene